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公开(公告)号：US20190124760A1
公开(公告)日：2019-04-25
申请号：US15788862
申请日：2017-10-20
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , James A. Gosse , Shun-Tien Lin , Michael Maynard , An Nguyen
Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.
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公开(公告)号：US10306751B2
公开(公告)日：2019-05-28
申请号：US15788862
申请日：2017-10-20
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , James A. Gosse , Shun-Tien Lin , Michael Maynard , An Nguyen
Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.
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Patent Agency Ranking
公开(公告)号：US10198391B2
公开(公告)日：2019-02-05
申请号：US14831169
申请日：2015-08-20
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , Kenneth J. Trotman
Abstract: An active input/output connector includes a first printed circuit board and a second printed circuit board enclosed within a housing. A first plug is in electronic communication with the first printed circuit board. A second plug is in electronic communication with the second printed circuit board. The first and second printed circuit boards are connected for communication of sensor signals from the first plug to the second plug.
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公开(公告)号：US20220418170A1
公开(公告)日：2022-12-29
申请号：US17360839
申请日：2021-06-28
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , Kenneth J. Trotman
Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.
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公开(公告)号：US11672106B2
公开(公告)日：2023-06-06
申请号：US17360839
申请日：2021-06-28
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , Kenneth J. Trotman
CPC classification number: H05K7/20872 , B64D37/34 , H05K7/20272 , H05K5/0291 , H05K7/20636
Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.
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公开(公告)号：US20180235069A1
公开(公告)日：2018-08-16
申请号：US15381149
申请日：2016-12-16
Applicant: Hamilton Sundstrand Corporation
Inventor： Kenneth J. Trotman , Jason C. Duffy
IPC: H05K1/02 , H01L23/40 , H01L23/433 , H05K7/20 , H05K3/30 , H01L23/367
CPC classification number: H05K1/0203 , H01L23/3675 , H01L23/40 , H01L23/4006 , H01L23/42 , H01L23/433 , H05K3/303 , H05K7/20436
Abstract: A heat sink for use with a thermal pad includes a heat sink body to engage the thermal pad, and a plurality of relief holes formed within the heat sink body, wherein the plurality of relief holes receives a portion of the thermal pad to limit an applied heat sink pressure onto the component.
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公开(公告)号：US20170052921A1
公开(公告)日：2017-02-23
申请号：US14831169
申请日：2015-08-20
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , Kenneth J. Trotman
CPC classification number: G06F13/4081 , H01R12/73 , H01R13/5202 , H01R13/622 , H01R13/6658 , H01R13/6675 , H01R31/065 , H01R2201/26 , H03M1/00
Abstract: An active input/output connector includes a first printed circuit board and a second printed circuit board enclosed within a housing. A first plug is in electronic communication with the first printed circuit board. A second plug is in electronic communication with the second printed circuit board. The first and second printed circuit boards are connected for communication of sensor signals from the first plug to the second plug.
Abstract translation: 有源输入/输出连接器包括封装在壳体内的第一印刷电路板和第二印刷电路板。 第一插头与第一印刷电路板电子通信。 第二插头与第二印刷电路板电子通信。 第一和第二印刷电路板被连接用于将传感器信号从第一插头传递到第二插头。
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