SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    2.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号:US20110014562A1

    公开(公告)日:2011-01-20

    申请号:US12887019

    申请日:2010-09-21

    IPC分类号: G03G13/16

    摘要: A substrate transfer system to reduce total processing time by transferring a substrate at a first delivery stage to a process block where processing can be carried out earliest. The substrate processing apparatus includes a first transfer device delivering a wafer with respect to a substrate carrier, and a second transfer device delivering a wafer between a plurality of process blocks and the first transfer device via a first delivery stage, to transfer the wafer with respect to the process blocks. The process block where there is no wafer or where processing of the last wafer within the relevant process block will be completed earliest is determined based on processing information of the wafers from the process blocks, and the wafer of the first delivery stage is transferred by the second transfer device to the relevant process block. This ensures smooth transfer of the wafer to the process block.

    摘要翻译: 一种基板转印系统,用于通过在第一递送阶段将基底转移到可以最早进行处理的工艺块来减少总处理时间。 衬底处理设备包括相对于衬底载体传送晶片的第一传输装置和经由第一传送级在多个处理块和第一传送装置之间传送晶片的第二传送装置,以相对于 到过程块。 基于来自处理块的晶片的处理信息,确定最早期完成相关处理块内没有晶片或最后晶片的处理块的处理块,并且第一传送阶段的晶片由 第二传输设备到相关进程块。 这确保晶片平滑地转移到处理块。