公开(公告)号：US20240178045A1

公开(公告)日：2024-05-30

申请号：US18551649

申请日：2022-06-15

申请人： Uwe BEIER

发明人： Uwe BEIER

IPC分类号： H01L21/687 ,  B25J11/00 ,  H01L21/677

CPC分类号： H01L21/68707 ,  B25J11/0095 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67781

摘要： A robot for handling flat substrates having one or more substrate holder(s), each substrate holder is for horizontally holding respectively one of the substrates, a carrier block holding the substrate holder or if several substrate holders are provided holding the substrate holders spaced from each other, and a robot arm. The carrier block is attached to the robot arm by an alignment facility, and the alignment facility is for aligning the carrier block.

公开(公告)号：US11823920B2

公开(公告)日：2023-11-21

申请号：US17124475

申请日：2020-12-16

申请人： JMJ Korea Co., Ltd.

发明人： Yun Hwa Choi ,  Jung Min Park

IPC分类号： H01L21/67 ,  B22F7/06 ,  B23K1/00 ,  B23K1/005 ,  B23K1/012 ,  B23K3/06 ,  B23K37/04 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  B23K103/12 ,  B23K101/40

CPC分类号： H01L21/67144 ,  B22F7/064 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/012 ,  B23K3/0607 ,  B23K37/04 ,  H01L21/67034 ,  H01L21/67333 ,  H01L21/67754 ,  H01L21/681 ,  B22F2301/10 ,  B22F2301/255 ,  B23K2101/40 ,  B23K2103/12

摘要： Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

公开(公告)号：US20230360942A1

公开(公告)日：2023-11-09

申请号：US18352557

申请日：2023-07-14

申请人： KOKUSAI ELECTRIC CORPORATION

发明人： Yasuhiro MIZUGUCHI ,  Naofumi OHASHI ,  Tadashi TAKASAKI ,  Shun MATSUI

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67745 ,  H01L21/67023 ,  H01L21/67253 ,  H01L21/67754

摘要： Described is a technique capable of optimizing a timing of a maintenance process. According to one aspect, there is a method of manufacturing a semiconductor device including: (a) transferring a substrate to a process chamber, and performing substrate processing; (b) receiving maintenance reservation information of the process chamber; (c) continuously performing the substrate processing related to the received maintenance reservation information, stopping a next substrate from being transferred into the process chamber after the substrate processing is completed, and thereafter setting the process chamber to the maintenance enable state; (d-1) receiving an instruction of advancing or delaying the maintenance timing within a predetermined range; and (d-2) starting the next substrate processing without setting the process chamber to the maintenance enable state when the instruction of delaying the maintenance timing is received in (d-1), and terminating the substrate processing when the instruction of advancing the maintenance timing is received in (d-1).

公开(公告)号：US11776831B2

公开(公告)日：2023-10-03

申请号：US17305545

申请日：2021-07-09

申请人： Tokyo Electron Limited

发明人： Takehiro Shindo

IPC分类号： H01L21/677 ,  H01L21/68

CPC分类号： H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  H01L21/67757 ,  H01L21/68

摘要： A substrate transport system for transporting a substrate in a vacuum atmosphere includes a vacuum chamber, inside of which is configured to be capable of being set to a vacuum atmosphere, a transport arm provided inside the vacuum chamber and configured to hold and transport the substrate, a horizontal movement mechanism configured to move the transport arm in a horizontal direction inside the vacuum chamber, a horizontal duct arm mechanism including therein an accommodation portion having a normal pressure atmosphere, the horizontal duct arm mechanism being configured to be extendable/contractible as the transport arm moves horizontally, a vertical movement mechanism configured to move the transport arm in a vertical direction inside the vacuum chamber, and a vertical duct arm mechanism including therein an accommodation portion having a normal pressure atmosphere, the vertical duct arm mechanism being configured to be extendable/contractible as the transport arm moves vertically.

公开(公告)号：US11749550B2

公开(公告)日：2023-09-05

申请号：US17556307

申请日：2021-12-20

申请人： KOKUSAI ELECTRIC CORPORATION

发明人： Yasuhiro Mizuguchi ,  Naofumi Ohashi ,  Tadashi Takasaki ,  Shun Matsui

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67745 ,  H01L21/67023 ,  H01L21/67253 ,  H01L21/67754

摘要： Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber wherein a maintenance timing at which the process chamber enters into a maintenance enable state is determined by the maintenance reservation information; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, stopping one or more substrates including the substrate from being transferred into the process chamber, and thereafter setting the process chamber to the maintenance enable state.

公开(公告)号：US20230268202A1

公开(公告)日：2023-08-24

申请号：US18106857

申请日：2023-02-07

申请人： Tokyo Electron Limited

发明人： Keita HIRASE ,  Koji TANAKA ,  Yukiyoshi SAITO ,  Keisuke SASAKI

IPC分类号： H01L21/67 ,  H01L21/311 ,  H01L21/677

CPC分类号： H01L21/67086 ,  H01L21/31111 ,  H01L21/67754 ,  H01L21/67757

摘要： A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed; a single-wafer processing section in which the substrates of the wafer lot is processed one by one; and an interface section that delivers the substrates between the batch processing section and the single-wafer processing section. The batch processing section includes: a processing bath in which the wafer lot is immersed and processed; and a first transfer device that transfers the wafer lot to the processing bath. The interface section includes: an immersion bath disposed outside a movement range of the first transfer device and that immerses the wafer lot; and a second transfer device that holds and transfers the wafer lot between the first transfer device and the immersion bath.

公开(公告)号：US20230215754A1

公开(公告)日：2023-07-06

申请号：US17996524

申请日：2021-04-14

申请人： Tokyo Electron Limited

发明人： Satoru KAWAKAMI ,  Nobuo MATSUKI

IPC分类号： H01L21/677 ,  H01J37/32 ,  H01L21/67 ,  C23C16/50 ,  C23C16/455 ,  C23C16/54 ,  C23C16/458

CPC分类号： H01L21/67754 ,  H01J37/32733 ,  H01L21/67161 ,  H01L21/6719 ,  C23C16/50 ,  C23C16/45565 ,  C23C16/54 ,  C23C16/4583 ,  H01J2237/201 ,  H01J2237/20235 ,  H01J2237/20214 ,  H01J2237/3321 ,  H01L21/68707

摘要： A substrate processing apparatus includes: a vacuum transfer chamber including a substrate transfer mechanism provided in a vacuum transfer space thereof to collectively hold and transfer substrates with a substrate holder; and a processing chamber having processing spaces and connected to the vacuum transfer chamber. The processing chamber includes a loading/unloading port provided on a side of the vacuum transfer chamber to allow the vacuum transfer space and the processing spaces to communicate with each other. The processing spaces include a first processing space in which a first process is performed on the substrate and a second processing space in which a second process is performed on the substrate subjected to the first process. The first and second processing spaces are arranged in a direction in which the substrate is loaded and unloaded, and the substrate holder has a length that extends over the first and second processing spaces.

公开(公告)号：US20190189490A1

公开(公告)日：2019-06-20

申请号：US16225671

申请日：2018-12-19

申请人： KOKUSAI ELECTRIC CORPORATION

发明人： Osamu MORITA ,  Yuji YAMAOKA ,  Shuichi KUBO ,  Toshiro KOSHIMAKI ,  Hiroyuki KITAMOTO

IPC分类号： H01L21/677 ,  H01L21/673 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67781 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/67309 ,  H01L21/67393 ,  H01L21/67754 ,  H01L21/67757 ,  H01L21/68771

摘要： There is provided an apparatus including a substrate holder to hold substrates including a product substrate and a dummy substrate, a transfer mechanism that loads the substrates into the substrate holder, a storage part to store a device parameter including at least the number of substrates that can be loaded on the substrate holder and the number of product substrates to be loaded on the substrate holder, and a controller to: (1) create substrate transfer data, which includes information indicating an order for transferring the substrates, transfer source information, and transfer destination information, according to the device parameter, (2) read the created substrate transfer data, (3) by transferring the substrates to the transfer mechanism based on the read substrate transfer data, transfer the dummy substrate to a substrate holding region except for a heat equalization region, and transfer the product substrate to the heat equalization region on the substrate holder.

公开(公告)号：US20180350646A1

公开(公告)日：2018-12-06

申请号：US15780680

申请日：2016-10-13

申请人： MURATA MACHINERY, LTD.

发明人： Osamu HONDA ,  Keiji YAMADA ,  Daisuke ONO ,  Takashi NOZAWA

IPC分类号： H01L21/677

CPC分类号： H01L21/67754 ,  B65G1/00 ,  B65G43/00 ,  H01L21/677 ,  H01L21/67724 ,  H01L21/67763

摘要： A conveyance system includes a track, ceiling conveyance vehicles, storage apparatuses, and a conveyance controller configured or programmed to control operations of the ceiling conveyance vehicles and a local vehicle in accordance with an operation mode. The storage apparatus includes a storage plate and the local vehicle that transfer a FOUP between the storage plate and an apparatus port. The conveyance controller switches the operation mode among a first mode prohibiting transfer from the apparatus port to the storage plate by the local vehicle, a second mode prohibiting transfer to the storage plate by any of the ceiling conveyance vehicles and transfer from the storage plate to the apparatus port by the local vehicle, and a third mode that does not restrict transfer by the local vehicle.

公开(公告)号：US10062600B2

公开(公告)日：2018-08-28

申请号：US14627667

申请日：2015-02-20

申请人： Intevac, Inc.

发明人： Terry Bluck ,  Vinay Shah ,  Ian Latchford ,  Alexandru Riposan

IPC分类号： H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC分类号： H01L21/68785 ,  H01L21/67173 ,  H01L21/67736 ,  H01L21/67754

摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.