公开(公告)号：US20230232587A1

公开(公告)日：2023-07-20

申请号：US18001753

申请日：2021-08-25

Applicant: Honor Device Co., Ltd.

Inventor： Qiao Sun ,  Kun Li ,  Silei Huyan ,  Mao Ye

IPC: H05K7/20 ,  H01Q1/02 ,  H04M1/02

CPC classification number: H05K7/2039 ,  H01Q1/02 ,  H04M1/0277

Abstract: Embodiments of this application provide an electronic device, which solves the problem of mutual influence between a heat dissipation component and a patch antenna in the electronic device by multiplexing a heat sink in the electronic device. The heat sink provided by the embodiments of this application can be used as a heat dissipation component to distribute heat evenly, so as to achieve the purpose of cooling down an overheated electronic element. In addition, the heat sink can be used as a radiator of an antenna to form an antenna unit with the feed unit and generate radiation to the outside. The heat sink in a first region can be used as a main radiator of the antenna unit to meet the demand for the number of antennas in a 5G wireless communication system, and can also be applied to other communication systems.