公开(公告)号：US20240357731A1

公开(公告)日：2024-10-24

申请号：US18302152

申请日：2023-04-18

申请人： PLUME DESIGN, INC.

发明人： Miroslav SAMARDZIJA ,  Ming-Tsung SU ,  Yun-Ping HUANG ,  Chun-Hung LIU ,  Yu-Han LIU ,  Liem Hieu Dinh VO

IPC分类号： H05K1/02 ,  H05K7/20 ,  H05K9/00

CPC分类号： H05K1/0216 ,  H05K7/2039 ,  H05K9/0024

摘要： Disclosed is a system and/or apparatus for a specifically configured and/or adapted electronic device that can provide interference shielding. The disclosed system and apparatus can be embodied with various combinations of components to effectuate improved thermal resistance while reducing noise within the device and/or among components of the device. The specifically configured components of the device can have specifically configured constitutions which can effectuate the thermal and noise limiters enabled by the disclosed system/apparatus.

公开(公告)号：US20240349454A1

公开(公告)日：2024-10-17

申请号：US18134471

申请日：2023-04-13

申请人： Jie Gui

发明人： Jie Gui

IPC分类号： H05K7/20 ,  G02B27/01 ,  G06F1/20

CPC分类号： H05K7/2039 ,  G02B27/0176 ,  G06F1/203 ,  H05K7/20218 ,  G06F2200/201

摘要： A liquid-filled cushion-shaped cooling device designed for virtual reality headsets is disclosed in this patent. The device is designed to lay around the area where the user's facial and virtual reality headset come in contact. The material of the cooling device uses good thermal conductive materials, such as PVC, silicon, etc. and a low-temperature liquid with large heat absorb capacity in the cushion such as gel, ice, water etc. to keep the contact area cool and refreshing while using virtual reality headset which emits heat generated from its own various components. The main cause of heat emission is mainly because the virtual reality device needs to seal the user's face or eyes into a mini space with the virtual reality headset lens in order to achieve an immersive experience, therefore causing poor ventilation in that area and discomfort in long-term contact between the device and facial area. The heat emission of the user's face also leads to more sultriness in that space. The liquid-filled cushion-shaped cooling device aims to address these issues by providing a comfortable and cool environment for the user while using virtual reality headsets. The cushion-shaped cooling device is easy to use and can be easily attached to any virtual reality headset.

公开(公告)号：US20240341062A1

公开(公告)日：2024-10-10

申请号：US18229197

申请日：2023-08-02

申请人： Fulian Precision Electronics (Tianjin) Co., LTD.

发明人： SUNG TSANG ,  TSUNG-LIN LIU ,  YU-CHIA TING

IPC分类号： H05K7/20

CPC分类号： H05K7/20327 ,  H05K7/2039 ,  H05K7/20818

摘要： A two-phase liquid cooling system for cooling electronic devices includes a housing configured for accommodating the electronic devices, a cooling loop connected to the housing, and an impedance device connected to the cooling loop. The cooling loop includes a supply manifold, a return manifold, and multiple cooling branches connected in parallel between the supply manifold and the return manifold, each cooling branch is configured for transferring cooling liquid to cool one electronic device. The impedance device increases impedance in each of the multiple cooling branches to reduce difference in impedance between each cooling branch and balances the pressure drop in each cooling branch, and thus balancing the cooling liquid flow rate in each cooling branch. A two-phase liquid cooling cabinet and method for liquid cooling of multiple electronic devices with different thermal loads are also disclosed.

公开(公告)号：US12111113B2

公开(公告)日：2024-10-08

申请号：US16666426

申请日：2019-10-29

申请人： ASIA VITAL COMPONENTS CO., LTD.

发明人： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC分类号： F28D15/04 ,  H05K7/20

CPC分类号： F28D15/04 ,  H05K7/20218 ,  H05K7/20336 ,  H05K7/2039

摘要： A heat transfer component reinforcement structure includes a main body. The main body has a pair of first lateral sides and a pair of second lateral sides and a reinforcement member. The reinforcement member is correspondingly externally connected with the main body in at least one manner selected from the group consisting of that the reinforcement members are engaged, latched and connected with the first lateral sides and the second lateral sides of the main body and the reinforcement members are engaged, latched and connected with the junctions between the first and second lateral sides in four corners.

公开(公告)号：US20240334654A1

公开(公告)日：2024-10-03

申请号：US18619307

申请日：2024-03-28

申请人： Aptiv Technologies AG

发明人： Lukasz Barus ,  Michal Przyjemski ,  Maciej Tyniec

IPC分类号： H05K7/20 ,  H05K7/14

CPC分类号： H05K7/2039 ,  H05K7/1402

摘要： A removable adapter for a housing of an upgradable electronic control unit. The adapter includes a body. The body includes a top surface and a base surface. The base surface is configured to contact the housing. The top surface includes one or more pedestals configured for contacting one or more electronic components of a printed circuit board.

公开(公告)号：US12108554B2

公开(公告)日：2024-10-01

申请号：US17898961

申请日：2022-08-30

申请人： YAZAKI CORPORATION

发明人： Chiaki Chida ,  Kentaro Imoto

IPC分类号： H05K7/12 ,  H05K7/20

CPC分类号： H05K7/12 ,  H05K7/2039

摘要： A fixing structure of an electronic component includes a fixing member configured to fix an electronic component while pressing the electronic component against a wall surface of a housing in a pressing direction; and a fastened portion which is provided at a position away from the wall surface of the housing and to which the fixing member is fastened and fixed. The fixing member includes a fixing portion that is fastened and fixed to the fastened portion, a pressing portion that extends from the fixing portion toward the electronic component and is configured to press the electronic component against the wall surface in the pressing direction, and an engaging portion which is provided at the fixing portion. The fastened portion includes an engaged portion that is engaged with the engaging portion, and is configured to limit movement of the fixing portion in a direction opposite to the pressing direction.

公开(公告)号：US12103294B2

公开(公告)日：2024-10-01

申请号：US17524871

申请日：2021-11-12

申请人： SHT Smart High-Tech AB

发明人： Johan Liu ,  Nan Wang

IPC分类号： B32B9/00 ,  B32B5/16 ,  B32B7/027 ,  B32B7/12 ,  B32B9/04 ,  C01B32/194 ,  F28F3/02 ,  F28F21/02 ,  H05K7/20 ,  B32B37/12 ,  B32B37/24 ,  B32B38/00 ,  B32B38/10 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： B32B9/007 ,  B32B5/16 ,  B32B7/027 ,  B32B7/12 ,  B32B9/04 ,  C01B32/194 ,  F28F3/02 ,  F28F21/02 ,  H05K7/2039 ,  B32B2037/1253 ,  B32B37/24 ,  B32B38/004 ,  B32B38/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2264/108 ,  B32B2307/302 ,  B32B2313/04 ,  B32B2319/00 ,  B32B2333/00 ,  B32B2363/00 ,  B32B2375/00 ,  B32B2379/08 ,  B32B2457/00 ,  B82Y30/00 ,  B82Y40/00 ,  Y10T156/1062 ,  Y10T156/108

摘要： Heat sink and method of manufacturing a graphene based heat sink, the method comprising: providing a first and second graphene film; arranging a layer of nanoparticles on a surface of the first and second graphene film to improve an adhesion strength between the graphene films; attaching the second graphene film to the first graphene film by means of an adhesive and the layer of nanoparticles; forming a laminated graphene film comprising a number of graphene film layers by repeating the steps, wherein the laminated graphene film is formed to have an anisotropic thermal conductivity; assembling a plurality of laminated graphene films by applying pressure and heat to cure the adhesive to form a graphene block; and removing selected portions of the graphene block to form a heat sink comprising fins extending from a base plate of the heat sink.

公开(公告)号：US20240288777A1

公开(公告)日：2024-08-29

申请号：US18655501

申请日：2024-05-06

申请人： Carl Zeiss SMT GmbH

发明人： Stefan Krone ,  Kai Kunze ,  Sven Urban ,  Philipp Torres Da Silva

IPC分类号： G03F7/00 ,  G02B26/08 ,  H05K7/20

CPC分类号： G03F7/70233 ,  G02B26/0816 ,  G03F7/70033 ,  G03F7/70833 ,  G03F7/70841 ,  G03F7/70983 ,  G03F7/70991 ,  H05K7/2039

摘要： A lithography optical system comprises: actuatable individual mirrors; a vacuum-tight housing; and an electronics arrangement integrated in the vacuum-tight housing and configured for individual actuation of each individual mirror. The electronics arrangement has a plurality of electronics modules releasably installed in the vacuum-tight housing and which each have a plurality of interconnected electronic and/or electrical components. A specific electronic module has a PCB, on which the electronic and/or electrical components of the specific electronics module are arranged. The PCB is arranged on a frame of the specific electronics module. The frame has a fastening section to releasably install the specific electronics module in the vacuum-tight housing and/or to connect the specific electronics module to a further electronics module of the electronics arrangement. When installed, the fastening section of the specific electronics module is in contact with a corresponding fastening section of the vacuum-tight housing and/or of the further electronics module.

公开(公告)号：US12074566B2

公开(公告)日：2024-08-27

申请号：US18320581

申请日：2023-05-19

申请人： Solaredge Technologies Ltd.

发明人： Guy Sella ,  Lior Handelsman ,  Vadim Shmukler ,  Meir Adest ,  Meir Gazit ,  Yoav Galin

IPC分类号： H05K5/00 ,  G08B13/14 ,  H02G15/10 ,  H02S40/34 ,  H05K5/02 ,  H05K5/06 ,  H05K7/20 ,  H05K9/00

CPC分类号： H02S40/34 ,  G08B13/1409 ,  H02G15/10 ,  H02S40/345 ,  H05K5/02 ,  H05K5/062 ,  H05K7/2039 ,  H05K9/0007 ,  H05K9/0009 ,  H05K9/0015 ,  Y10S248/906 ,  Y10T29/49117

摘要： A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board for electrical power conversion. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber.

公开(公告)号：US20240279523A1

公开(公告)日：2024-08-22

申请号：US18108460

申请日：2023-02-10

申请人： Westlake Epoxy Inc.

发明人： Christoph SCHEUER ,  Gabriele BADINI ,  Alexander LINZNER ,  Thomas DRESSEN

IPC分类号： C09K5/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/34 ,  C08L63/00 ,  H05K7/20

CPC分类号： C09K5/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/34 ,  C08L63/00 ,  H05K7/2039 ,  B32B2307/302 ,  C08K2003/343 ,  C08K2201/001

摘要： Embodiments of the present disclosure generally relate to epoxy resin compositions, methods of making epoxy resin compositions, and to uses of epoxy resin compositions. In an embodiment, the composition includes an epoxy resin, a latent catalytic curing agent, and a filler. The composition can be used in an article. In an embodiment, an article includes a heat-generating member, and a composition disposed on the heat-generating member, the composition comprising: an epoxy resin, a latent catalytic curing agent, and a filler.