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公开(公告)号:US20240363998A1
公开(公告)日:2024-10-31
申请号:US18649235
申请日:2024-04-29
Applicant: ITC CO., LTD
Inventor: Keun Deok LEE
CPC classification number: H01Q1/36 , H01Q1/02 , H01Q11/083
Abstract: An electromagnetic wave irradiation apparatus includes a housing having a hollow portion formed inside and an open lower side; a coil-type antenna with a spiral shape in the hollow portion and configured to emit electromagnetic waves; a window coupled to the open lower side of the housing; and a capacitance variation measurement unit configured to measure a capacitance variation of the coil-type antenna. The electromagnetic wave irradiation apparatus may further include a cooling unit configured to cool at least one of the window or the housing. The capacitance variation measurement unit includes a capacitance sensor with one side connected to the coil-type antenna and the other side connected to the ground.
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公开(公告)号:US12126096B2
公开(公告)日:2024-10-22
申请号:US18378017
申请日:2023-10-09
Applicant: BlueHalo, LLC
Inventor: Michael Thomas Pace , David Gregory Baur , Theodore Lyman Schuler-Sandy , William Kennedy , Jeffrey Gerard Micono , William Louis Walker , Garrett James Newell
IPC: H01Q21/00 , G01S3/04 , G01S3/38 , G01S3/40 , G01S3/42 , H01Q1/02 , H01Q3/08 , H01Q3/20 , H01Q3/22 , H01Q3/26 , H01Q3/34 , H01Q3/38 , H01Q5/28 , H01Q5/48 , H01Q15/16 , H01Q19/10 , H01Q19/13 , H01Q21/06 , H04B7/0408 , H04B7/06 , H04B7/08 , H04B17/23
CPC classification number: H01Q5/48 , G01S3/043 , G01S3/046 , G01S3/38 , G01S3/40 , G01S3/42 , H01Q1/02 , H01Q3/08 , H01Q3/20 , H01Q3/22 , H01Q3/2682 , H01Q3/34 , H01Q3/38 , H01Q5/28 , H01Q15/16 , H01Q19/108 , H01Q19/13 , H01Q21/0068 , H01Q21/062 , H04B7/0408 , H04B7/0639 , H04B7/0695 , H04B7/086 , H04B7/0865 , H04B17/23
Abstract: Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.
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公开(公告)号:US12119862B1
公开(公告)日:2024-10-15
申请号:US18513055
申请日:2023-11-17
Applicant: Battelle Memorial Institute
Inventor: David R. Chase , Micah Blue , Michael Jansen , Curt Hudberg
CPC classification number: H04B1/40 , H01Q1/02 , H04B7/0686 , H04B7/0868
Abstract: An air interface plane (AIP) of a radio frequency (RF) aperture includes: a circuit board having a first side and a second side opposite the first side; and a matrix of tapered elements arranged on the first side of the circuit board and secured to the circuit board, the matrix of tapered elements cooperating to at least one of receive or transmit an over-the-air RF signal. Suitably, each tapered element of the matrix has: a central hub extending along a longitudinal axis from a hub base which is proximate to the first side of the circuit board to an apex of the tapered element which is distal from the first side of the first circuit board; and a plurality of arms extending from the central hub at the apex of the tapered element, each of the plurality of arms including a first portion that projects the arm radially away from the longitudinal axis and a second portion that projects the arm longitudinally toward the first side of the circuit board.
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公开(公告)号:US12119539B2
公开(公告)日:2024-10-15
申请号:US17702799
申请日:2022-03-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Naoki Gouchi , Kengo Onaka
CPC classification number: H01Q1/2208 , H01Q1/02 , H01Q1/20 , H01Q1/38
Abstract: An antenna module includes an antenna substrate including a feed element, and a radio frequency integrated circuit (RFIC) mounted on a lower surface of the antenna substrate. The antenna substrate includes a mount portion on which the RFIC is mounted and an overhang portion that extends outward from the mount portion. The feed element is disposed in the mount portion and the overhang portion. The antenna module further includes a heat dissipator disposed on the lower surface of the overhang portion.
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公开(公告)号:US12113274B2
公开(公告)日:2024-10-08
申请号:US18232024
申请日:2023-08-09
Applicant: Airgain, Inc.
Inventor: Kevin Thill , Callum Noon , Larry Greenstein
IPC: H01Q1/32 , H01Q1/02 , H04B1/3822 , H04L27/00 , H04W4/48
CPC classification number: H01Q1/3275 , H04B1/3822 , H04W4/48 , H01Q1/02 , H04L27/0002
Abstract: An antenna assembly includes a base, a modem, a top lid and a housing. The base is composed of an aluminum material. The modem is disposed on the base. The top lid is for the base, and the top lid includes at least one antenna element disposed on an exterior surface. The housing covers the top lid and base. The top lid acts as an electro-magnetic barrier for the modem. A communication cable is connected to the modem at one end and extending to and connected to a vehicle internal router with a vehicle modem at the other end.
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公开(公告)号:US12113267B2
公开(公告)日:2024-10-08
申请号:US18201526
申请日:2023-05-24
Applicant: Airgain, Inc.
Inventor: Larry Greenstein , Joe L. Romack
CPC classification number: H01Q1/02 , H01Q1/3275 , H01Q1/42 , H05K7/20481 , H05K7/20509
Abstract: A heat dissipation system for an antenna assembly for a vehicle is disclosed that provides enhanced heat removal attributes and that provides heat transfer from various components to a heat sink through different heat transfer flow paths to reduce the transfer of heat from high heat producing components to heat sensitive components. Improved heat insulation components can be added to maximize the thermal isolation between heat producing components and to prevent heat transferred from the vehicle into the antenna assembly.
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公开(公告)号:US20240304978A1
公开(公告)日:2024-09-12
申请号:US18668053
申请日:2024-05-17
Applicant: PELTBEAM INC.
Inventor: Mehdi HATAMIAN , Venkat KALKUNTE
CPC classification number: H01Q1/02 , H01Q1/2283 , G01J5/12 , G01J2005/123
Abstract: A communication apparatus that includes an antenna array comprising a plurality of antenna elements, a plurality of thermoelectric devices distributed across the plurality of antenna element of the antenna array, each of the plurality of thermoelectric devices covers a different subset of a plurality of subsets of the plurality of antenna elements, and a processor coupled to the antenna array and the plurality of thermoelectric devices. The processor detects variation in power consumption in the plurality of antenna elements of the antenna array on a basis of a change in a performance state of the plurality of antenna elements, and controls the plurality of thermoelectric devices to substantially equalize a temperature associated with the plurality of antenna elements for substantial equalization of the performance state of the plurality of antenna elements, where the plurality of thermoelectric devices is controlled based on the detected variation in the power consumption.
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公开(公告)号:US12088021B2
公开(公告)日:2024-09-10
申请号:US18368840
申请日:2023-09-15
Applicant: BlueHalo, LLC
Inventor: Michael Thomas Pace , David Gregory Baur , Theodore Lyman Schuler-Sandy , William Kennedy , Jeffrey Gerard Micono , William Louis Walker , Garrett James Newell
IPC: H01Q21/00 , G01S3/04 , G01S3/38 , G01S3/40 , G01S3/42 , H01Q1/02 , H01Q3/08 , H01Q3/20 , H01Q3/22 , H01Q3/26 , H01Q3/34 , H01Q3/38 , H01Q5/28 , H01Q5/48 , H01Q15/16 , H01Q19/10 , H01Q19/13 , H01Q21/06 , H04B7/0408 , H04B7/06 , H04B7/08 , H04B17/23
CPC classification number: H01Q5/48 , G01S3/043 , G01S3/046 , G01S3/38 , G01S3/40 , G01S3/42 , H01Q1/02 , H01Q3/08 , H01Q3/20 , H01Q3/22 , H01Q3/2682 , H01Q3/34 , H01Q3/38 , H01Q5/28 , H01Q15/16 , H01Q19/108 , H01Q19/13 , H01Q21/0068 , H01Q21/062 , H04B7/0408 , H04B7/0639 , H04B7/0695 , H04B7/086 , H04B7/0865 , H04B17/23
Abstract: Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.
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公开(公告)号:US20240291151A1
公开(公告)日:2024-08-29
申请号:US18648991
申请日:2024-04-29
Applicant: BlueHalo, LLC
Inventor: Michael Thomas Pace , David Gregory Baur , Theodore Lyman Schuler-Sandy , William Kennedy , Jeffrey Gerard Micono , William Louis Walker , Garrett James Newell
IPC: H01Q5/48 , G01S3/04 , G01S3/38 , G01S3/40 , G01S3/42 , H01Q1/02 , H01Q3/08 , H01Q3/20 , H01Q3/22 , H01Q3/26 , H01Q3/34 , H01Q3/38 , H01Q5/28 , H01Q15/16 , H01Q19/10 , H01Q19/13 , H01Q21/00 , H01Q21/06 , H04B7/0408 , H04B7/06 , H04B7/08 , H04B17/23
CPC classification number: H01Q5/48 , G01S3/043 , G01S3/046 , G01S3/38 , G01S3/40 , G01S3/42 , H01Q1/02 , H01Q3/08 , H01Q3/20 , H01Q3/22 , H01Q3/2682 , H01Q3/34 , H01Q3/38 , H01Q5/28 , H01Q15/16 , H01Q19/108 , H01Q19/13 , H01Q21/0068 , H01Q21/062 , H04B7/0408 , H04B7/0639 , H04B7/0695 , H04B7/086 , H04B7/0865 , H04B17/23
Abstract: Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.
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公开(公告)号:US20240291136A1
公开(公告)日:2024-08-29
申请号:US18658201
申请日:2024-05-08
Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
Inventor: Haoshen ZHU , Zhirui CHEN , Wenjie FENG , Quan XUE
CPC classification number: H01Q1/2283 , H01L23/5385 , H01L24/16 , H01L25/105 , H01Q1/02 , H01L2224/16145 , H01L2224/16227 , H04B1/40
Abstract: The present invention provides a three-dimensional heterogeneous integrated millimeter-wave system package structure, which is composed of an upper antenna board and a lower chip carrier board. The upper antenna board has an integrated structure with an antenna in package and a feed network arranged inside, the lower chip carrier board has a modular structure provided with a first chipset and a second chipset which are heterogeneous integrated, and each chipset comprises a plurality of chips of the same or different processes.
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