公开(公告)号：US20170077010A1

公开(公告)日：2017-03-16

申请号：US15123484

申请日：2014-03-20

Applicant: HUAWEI DEVICE CO., LTD.

Inventor： Longping YAN ,  Konggang WEI ,  Hualin LI

IPC: H01L23/427 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/427 ,  H01L21/4882 ,  H01L23/3675 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A mobile terminal is provided. The mobile terminal includes a circuit board, where a chip is disposed on a first surface of the circuit board. A groove is provided on a second surface of the circuit board. The mobile terminal further includes: a heat pipe that is disposed in the groove. One end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board.

Abstract translation: 提供移动终端。 移动终端包括电路板，其中芯片设置在电路板的第一表面上。 在电路板的第二表面上设置槽。 移动终端还包括：设置在槽中的热管。 热管的一端延伸到电路板的侧壁或电路板的侧壁的外侧。

公开(公告)号：US20170098592A1

公开(公告)日：2017-04-06

申请号：US15125952

申请日：2014-03-18

Applicant: HUAWEI DEVICE CO., LTD.

Inventor： Linfang JIN ,  Yongwang XIAO ,  Guoping WANG ,  Jie ZOU ,  Hualin LI

IPC: H01L23/427 ,  H01L23/373 ,  H01L23/367 ,  H01L23/552

CPC classification number: H01L23/427 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

公开(公告)号：US20200083144A1

公开(公告)日：2020-03-12

申请号：US16683287

申请日：2019-11-14

Applicant: Huawei Device Co., Ltd.

Inventor： Linfang JIN ,  Yongwang XIAO ,  Guoping WANG ,  Jie Zou ,  Hualin LI

IPC: H01L23/427 ,  H01L23/552 ,  H01L23/373 ,  H01L23/367

Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

公开(公告)号：US20170139452A1

公开(公告)日：2017-05-18

申请号：US15127705

申请日：2014-03-21

Applicant: HUAWEI DEVICE CO., LTD.

Inventor： Xiangyang YANG ,  Linfang JIN ,  Hualin LI ,  Wenbing TANG ,  Jie ZOU

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1626 ,  H05K1/0203

Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.