公开(公告)号：US20240365522A1

公开(公告)日：2024-10-31

申请号：US18641747

申请日：2024-04-22

申请人： Drexel University ,  Korea Institute of Science and Technology

发明人： Yury Gogotsi ,  Babak Anasori ,  Mohamed H. Alhabeb ,  Christine B. Hatter ,  Chong Min Koo ,  Soon Man Hong ,  Faisal Shahzad

IPC分类号： H05K9/00 ,  C01B32/921 ,  H01B1/20 ,  H01L23/29 ,  H01L23/552

CPC分类号： H05K9/0088 ,  H01B1/20 ,  H01L23/295 ,  H01L23/552 ,  H05K9/0084 ,  C01B32/921 ,  C01P2002/20 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2006/40 ,  H01L2924/3025

摘要： The present disclosure is directed to materials which provide electromagnetic shielding and methods of providing such electromagnetic shielding. In particular, the present disclosure describes the use of two-dimensional transition metal carbide, nitride, and carbonitride materials for this purpose.

公开(公告)号：US12132006B2

公开(公告)日：2024-10-29

申请号：US17566579

申请日：2021-12-30

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Pao-Nan Lee ,  Chen-Chao Wang ,  Chang Chi Lee

IPC分类号： H01L23/31 ,  H01L23/552 ,  H01L25/16 ,  H01L49/02

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L25/16 ,  H01L28/10 ,  H01L28/40

摘要： A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

公开(公告)号：US12131997B2

公开(公告)日：2024-10-29

申请号：US17844337

申请日：2022-06-20

申请人： SK hynix Inc.

发明人： Won Duck Jung

IPC分类号： H01L23/528 ,  H01L23/00 ,  H01L23/552 ,  H01L25/065 ,  H01L23/498

CPC分类号： H01L23/5286 ,  H01L23/528 ,  H01L23/552 ,  H01L24/05 ,  H01L24/46 ,  H01L25/0657 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311

摘要： A semiconductor package is configured to include a package substrate, a semiconductor chip disposed on the package substrate, and bonding wires. The package substrate includes a first column of bond fingers disposed in a first layer and a second column of bond fingers disposed in a second layer. The semiconductor chip includes a first column of chip pads arrayed in a first column and a second column of chip pads arrayed in a second column adjacent to the first column. The first column of chip pads are connected to the first column of bond fingers, respectively, through first bonding wires, and the second column of chip pads are connected to the second column of bond fingers, respectively, through second bonding wires.

公开(公告)号：US20240355643A1

公开(公告)日：2024-10-24

申请号：US18639994

申请日：2024-04-19

申请人： JCET STATS ChipPAC Korea Limited

发明人： Bom LEE ,  SeongHwan PARK ,  InHo SEO ,  SeungHyun LEE

IPC分类号： H01L21/56 ,  H01L23/552

CPC分类号： H01L21/561 ,  H01L23/552

摘要： A method for making a semiconductor device is provided. The method comprises: providing a package substrate strip mounted thereon multiple sets of first electronic components and multiple sets of second electronic components; forming an encapsulant layer on the package substrate strip that covers the multiple sets of first electronic components; forming a first shielding material by spray coating such that the first shielding material extends continuously from a top surface of the encapsulant layer to a top surface of the package substrate strip to cover at least a side surface of the encapsulant layer facing towards the multiple sets of second electronic components; singulating the package substrate strip into individual semiconductor packages with respective package substrates; and forming a second shielding material on the encapsulant layer by sputtering, wherein the second shielding material at least partially overlaps with the first shielding material.

公开(公告)号：US12125310B2

公开(公告)日：2024-10-22

申请号：US18381451

申请日：2023-10-18

申请人： BEIJING BOE SENSOR TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Yajie Feng ,  Cheng Li ,  Yue Geng ,  Kuiyuan Wang ,  Zefei Li ,  Chaoyang Qi ,  Yi Dai ,  Xiaoguan Li ,  Yingzi Wang

IPC分类号： G06V40/13 ,  H01L23/552 ,  H01L27/146

CPC分类号： G06V40/1318 ,  H01L23/552 ,  H01L27/14603 ,  H01L27/14612 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14678

摘要： An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element, having one end electrically connected to the second capacitor plate; a first electrode layer electrically connected to another end of the photosensitive element. On the substrate, an orthographic projection of the second capacitor plate at least partially overlaps with that of the first electrode layer, and the first capacitor plate is located in the same layer and has the same material as the gate of the TFT.

公开(公告)号：US20240347472A1

公开(公告)日：2024-10-17

申请号：US18300708

申请日：2023-04-14

申请人： Allegro MicroSystems, LLC

发明人： Vijay Mangtani ,  William P. Taylor ,  Paul A. David

IPC分类号： H01L23/552 ,  H01F27/28 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L25/065

CPC分类号： H01L23/552 ,  H01F27/2804 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48245

摘要： Aspects of the present disclosure include systems, structures, circuits, and methods providing voltage-isolated integrated circuit (IC) packages or modules having a transformer integrated with or implemented on a lead frame. A portion of transformer windings may include a conductive portion of a lead frame. Conductive structure, such as wire bonds, may be used for other portions of transformer windings. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The IC packages and modules may include various types of circuits; in some examples, IC packages or modules may include a galvanically isolated gate driver or other high voltage circuit.

公开(公告)号：US20240339442A1

公开(公告)日：2024-10-10

申请号：US18131998

申请日：2023-04-07

申请人： Rockwell Collins, Inc.

发明人： Orion D. Davies ,  Haley M. Steffen

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L23/552

CPC分类号： H01L25/165 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552

摘要： A package is described. The package includes a die covered by a lid. The lid maintains a hermetic seal for the die. The package includes high frequency shunt capacitance in parallel with surface-mount capacitors. The high frequency shunt capacitance is formed by interdigital capacitors below the surface-mount capacitors. The interdigital capacitors, the surface-mount capacitors, and the die form a circuit which produces a stable output voltage. The output voltage may remain stable even when subject to noise due to energized particles in space. The package includes solder resist with openings for attaching the surface-mount capacitors to the interdigital capacitors. Advantageously, the interdigital capacitors may achieve high frequency shunt capacitance on the order of nano-farads as part of the frame geometry with minimal increase in package height.

公开(公告)号：US20240339394A1

公开(公告)日：2024-10-10

申请号：US18605842

申请日：2024-03-15

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee JUNG ,  ChangOh KIM

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L23/49894 ,  H01L21/56 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/13016 ,  H01L2224/16227

摘要： A partially shielded semiconductor device and a method for making the same are provided. The method may include: providing a package including: a substrate; an electronic component mounted on the substrate; an encapsulant formed on the substrate and encapsulating the electronic component; and a coating layer formed on the substrate and adjacent to the encapsulant; performing a laser hatching process on the encapsulant and a portion of the coating layer adjacent to the encapsulant to remove the portion of the coating layer to form a trench between the encapsulant and the coating layer; and electroless-plating a conductive material to cover the encapsulant and fill the trench between the encapsulant and the coating layer.

公开(公告)号：US12106973B2

公开(公告)日：2024-10-01

申请号：US17513037

申请日：2021-10-28

申请人： Silicon Laboratories Inc.

发明人： Erwin Hendarto

IPC分类号： H01L21/56 ,  B23K26/362 ,  B23K101/40 ,  H01L21/67 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552

CPC分类号： H01L21/565 ,  B23K26/362 ,  H01L21/67075 ,  H01L23/3157 ,  H01L23/552 ,  H01L24/49 ,  B23K2101/40 ,  H01L2924/01047 ,  H01L2924/18165

摘要： In one embodiment, a method includes: laser ablating an encapsulant of a semiconductor package, until a threshold amount of the encapsulant remains above one or more die of the semiconductor package; and providing at least one drop of acid onto a surface of the ablated semiconductor package to acid etch for a first time duration, to remove a remaining portion of the encapsulant above the one or more die, where after the acid etch, a die of interest is exposed and the silver bond wires of the semiconductor package are preserved.

公开(公告)号：US20240312927A1

公开(公告)日：2024-09-19

申请号：US18671764

申请日：2024-05-22

申请人： Snap Inc.

发明人： Stephen Andrew Steger ,  Emily Lauren Clopp

IPC分类号： H01L23/552 ,  H05K1/02 ,  H05K9/00

CPC分类号： H01L23/552 ,  H05K1/0216 ,  H05K9/0081 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K2201/0707 ,  H05K2201/10371

摘要： Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.