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公开(公告)号:US20130095677A1
公开(公告)日:2013-04-18
申请号:US13693514
申请日:2012-12-04
Applicant: Huawei Device Co., Ltd.
Inventor: Linfang JIN , Yaming Jiang
IPC: H01R31/00
CPC classification number: H01R31/00 , H01R24/62 , H01R35/04 , H05K5/0278
Abstract: An embodiment of the present invention discloses a rotatable data card. The rotatable data card includes a data card body, a USB connector, and a rotating shaft assembly. The rotating shaft assembly includes a rotating shaft, a fixed fluted disk, and a rotating shaft casing. The rotating shaft and the fixed fluted disk are accommodated in the rotating shaft casing. Teeth are set on the rotating shaft and the fixed fluted disk, and the rotating shaft and the fixed fluted disk are engaged with each other. The USB connector includes a bracket, where a hole is opened on the bracket . The rotating shaft casing is fixed in the hole. The rotating shaft is fixedly connected to the data card body. The rotating shaft rotates relative to the fixed fluted disk, and an angle between the data card body and the USB connector is never 180 degrees.
Abstract translation: 本发明的实施例公开了一种可旋转的数据卡。 可旋转数据卡包括数据卡主体,USB连接器和旋转轴组件。 旋转轴组件包括旋转轴,固定凹槽盘和旋转轴壳。 旋转轴和固定凹槽盘容纳在旋转轴壳体中。 将齿固定在旋转轴和固定槽形盘上,并且旋转轴和固定凹槽盘彼此接合。 USB连接器包括支架,支架上有一个孔。 旋转轴壳体固定在孔中。 旋转轴与数据卡主体固定连接。 旋转轴相对于固定的凹槽盘旋转,并且数据卡主体和USB连接器之间的角度绝不为180度。
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公开(公告)号:US20170098592A1
公开(公告)日:2017-04-06
申请号:US15125952
申请日:2014-03-18
Applicant: HUAWEI DEVICE CO., LTD.
Inventor: Linfang JIN , Yongwang XIAO , Guoping WANG , Jie ZOU , Hualin LI
IPC: H01L23/427 , H01L23/373 , H01L23/367 , H01L23/552
CPC classification number: H01L23/427 , H01L23/3675 , H01L23/3736 , H01L23/3737 , H01L23/552 , H01L2924/0002 , H01L2924/00
Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
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公开(公告)号:US20200083144A1
公开(公告)日:2020-03-12
申请号:US16683287
申请日:2019-11-14
Applicant: Huawei Device Co., Ltd.
Inventor: Linfang JIN , Yongwang XIAO , Guoping WANG , Jie Zou , Hualin LI
IPC: H01L23/427 , H01L23/552 , H01L23/373 , H01L23/367
Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.
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公开(公告)号:US20170139452A1
公开(公告)日:2017-05-18
申请号:US15127705
申请日:2014-03-21
Applicant: HUAWEI DEVICE CO., LTD.
Inventor: Xiangyang YANG , Linfang JIN , Hualin LI , Wenbing TANG , Jie ZOU
CPC classification number: G06F1/203 , G06F1/1626 , H05K1/0203
Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.
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