公开(公告)号：US10756000B2

公开(公告)日：2020-08-25

申请号：US16683287

申请日：2019-11-14

Applicant: Huawei Device Co., Ltd.

Inventor： Linfang Jin ,  Yongwang Xiao ,  Guoping Wang ,  Jie Zou ,  Hualin Li

IPC: H01L23/427 ,  H01L23/552 ,  H01L23/367 ,  H01L23/373

Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.