公开(公告)号：US12114461B2

公开(公告)日：2024-10-08

申请号：US17711843

申请日：2022-04-01

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Chunxia Xu ,  Jun Chen ,  Xiaowei Hui ,  Hao Wu

IPC: H05K7/20 ,  H01R13/66 ,  H01R24/68

CPC classification number: H05K7/20145 ,  H01R13/665 ,  H01R24/68 ,  H05K7/20909

Abstract: A power adapter and a manufacturing method thereof are provided. The power adapter includes a housing, a circuit board assembly, and a first heat dissipation part. There is accommodation space inside the housing, a line interface is disposed at a first end of the housing, and a power connector is disposed at a second end of the housing. The circuit board assembly is disposed in the accommodation space, and the circuit board assembly is electrically connected to the line interface and the power connector. The first heat dissipation part coats the outside of the circuit board assembly, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing.

公开(公告)号：US20240098879A1

公开(公告)日：2024-03-21

申请号：US18525081

申请日：2023-11-30

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Chunxia Xu ,  Xiaowei Hui ,  Hao Wu

IPC: H05K1/02 ,  B60L53/14 ,  H02J7/00 ,  H02J50/12 ,  H05K7/20

CPC classification number: H05K1/0209 ,  B60L53/14 ,  H02J7/0042 ,  H02J50/12 ,  H05K7/20218 ,  H05K2201/062

Abstract: This disclosure discloses a power adapter and an electronic device system, and relates to the field of heat dissipation technologies. The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing. The printed circuit board assembly is fastened in the housing, and the insulation powder is used to conduct heat generated by the printed circuit board assembly to the housing. Compared with a thermally conductive adhesive, the insulation powder does not have a problem of poor fluidity, and can more easily be sufficiently filled. This solution improves heat dissipation effect of the power adapter and helps further increase a charging power of the power adapter.

公开(公告)号：US11800677B2

公开(公告)日：2023-10-24

申请号：US17665225

申请日：2022-02-04

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hao Wu ,  Jun Chen ,  Chunxia Xu ,  Xiaowei Hui

IPC: H01R13/66 ,  H05K7/20 ,  H01R24/68

CPC classification number: H05K7/20145 ,  H01R13/665 ,  H01R24/68 ,  H05K7/20909

Abstract: A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.