公开(公告)号：US20250118617A1

公开(公告)日：2025-04-10

申请号：US18988140

申请日：2024-12-19

Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.

Inventor： Huibin CHEN ,  Jiyang LI ,  Heng WANG

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07

Abstract: A power module includes a first substrate, a second substrate, a first heat sink, a second heat sink, and a chip that are disposed opposite to each other. The chip is disposed between the first heat sink and the second heat sink that are disposed opposite to each other. The first heat sink and the second heat sink are connected to the chip through sintering or welding. The first substrate and the second substrate are respectively connected to the first heat sink and the second heat sink through welding or sintering.

公开(公告)号：US20220352842A1

公开(公告)日：2022-11-03

申请号：US17858812

申请日：2022-07-06

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Jiangang WANG ,  Jiyang LI ,  Wen YE

IPC: H02P29/68 ,  H05K7/20 ,  H02P27/06 ,  H02K9/19 ,  H02K7/14 ,  B60L53/20 ,  B60L3/00

Abstract: This application provides a powertrain, a coolant flow rate estimation method, and an electric vehicle. Coolant in a first cooling loop of the powertrain is configured to cool an inverter. An electronic pump drives the coolant to circulate in the first cooling loop. When a phase current of a motor is greater than or equal to a preset current value, a controller determines a rotation speed of the electronic pump at a first moment as a first rotation speed, and determines a coolant flow rate at the first moment based on a temperature at a first position in the first cooling loop, a temperature at a second position in the inverter, and a power loss of the inverter. In the solution of this application, data does not need to be separately calibrated for different thermal management systems. This reduces time consumed by data calibration and improves practicability.

公开(公告)号：US20240349463A1

公开(公告)日：2024-10-17

申请号：US18756775

申请日：2024-06-27

Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.

Inventor： Yongqi QIU ,  Jiyang LI

IPC: H05K7/20

CPC classification number: H05K7/208 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20354

Abstract: This application provides a heat exchange device and a heat exchange system. The heat exchange device has a first heat exchange mode, and includes a housing, a partition plate, an evaporator, and a compressor. The partition plate divides space inside the housing into an internal circulation cavity and an external circulation cavity. The evaporator and the compressor are located in the internal circulation cavity. A first valve group is disposed between an inlet of the compressor and an outlet of the evaporator. When the first heat exchange mode is used for heat exchange, the evaporator is communicated with the compressor by using the first valve group. In this application, the compressor is disposed in the internal circulation cavity, so that a temperature difference between the compressor and the evaporator is small, thereby reducing a slugging risk of the compressor.