ENERGY EFFICIENT LIQUID-COOLED DATACENTERS
    2.
    发明公开

    公开(公告)号:US20240284640A1

    公开(公告)日:2024-08-22

    申请号:US18648845

    申请日:2024-04-29

    发明人: Ali Heydari

    摘要: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, method for operating a datacenter includes receiving a source of gas to a fuel cell to produce electrical power. The method further includes providing the electrical power to one or more electronic components in the datacenter. The method further includes capturing waste heat, generated by the fuel cell in converting the gas to the electrical power, using a heat exchanger. The method further includes providing the waste heat to an absorption chiller to produce cooled liquid to be utilized with a cooling system to remove heat from the one or more electronic components.

    BLENDED OPERATION MODE FOR PROVIDING COOLING TO A HEAT LOAD

    公开(公告)号:US20240081029A1

    公开(公告)日:2024-03-07

    申请号:US18463764

    申请日:2023-09-08

    IPC分类号: H05K7/20

    摘要: Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, and a blended mode between the adiabatic mode and the evaporative mode, depending on environmental conditions. The blended mode can be enabled by a fluid transmission and retention device fluidically connected to the inlet and outlet of the evaporative cooler, the recovery coil outlet, and the heat load. The fluid transmission and retention device can variably distribute the cooling fluid exiting the recovery coil and the cooling fluid exiting the evaporative cooler to one or both of the heat load and the evaporative cooler inlet. In an example, the fluid transmission and retention device includes a manifold. In another example, the fluid transmission and retention device includes one or more tanks.

    Bidirectional connector for server liquid cooling

    公开(公告)号:US11792959B2

    公开(公告)日:2023-10-17

    申请号:US17483029

    申请日:2021-09-23

    申请人: Baidu USA LLC

    发明人: Tianyi Gao

    IPC分类号: H05K7/20

    摘要: According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.

    SERVER PACKAGING FOR IMMERSION COOLING WITH LOCAL ACCELERATION

    公开(公告)号:US20230301035A1

    公开(公告)日:2023-09-21

    申请号:US17699490

    申请日:2022-03-21

    申请人: Baidu USA LLC

    发明人: TIANYI GAO

    IPC分类号: H05K7/20

    摘要: A cooling unit includes a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis, an inlet port coupled to a first side of the channel frame to receive a coolant fluid, an outlet port coupled to a second side of the channel frame for coolant fluid in either a liquid phase or a vapor phase to exit the channel frame, and an internal structure disposed on an inner surface of the channel frame between the inlet port and the outlet port. The internal structure guides the coolant fluid flow and/or distribution along a surface of the electronic chip, where the electronic chip transfers heat to the coolant fluid to cause a portion of the coolant fluid to change from a liquid to a vapor phase.