公开(公告)号：US20230290743A1

公开(公告)日：2023-09-14

申请号：US18317474

申请日：2023-05-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhenxing Xiong ,  Wangliang Liu ,  Zengqi Lan ,  Caijun Zhao ,  Xiang Xu

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/498 ,  H01L23/40 ,  H05K1/02

CPC classification number: H01L23/562 ,  H01L23/552 ,  H01L23/49861 ,  H01L23/40 ,  H05K1/0271 ,  H05K1/023 ,  H01L2023/4068

Abstract: This application relates to the field of chip technologies, and provides a reinforcement structure and an electronic device. The reinforcement structure includes a support frame, an accommodation chamber, and an electromagnetic radiation suppression structure. The accommodation chamber is provided on the support frame and runs through a first surface and a second surface of the support frame that are opposite to each other. The accommodation chamber is used for accommodating a chip package structure disposed on a printed circuit board. A wall surface that is of the support frame and that defines the accommodation chamber is an inner surface, and a wall surface of the support frame opposite to the inner surface is an outer surface. The electromagnetic radiation suppression structure is disposed on at least one of the first surface, the second surface, the inner surface, and the outer surface.