公开(公告)号：US20220287175A1

公开(公告)日：2022-09-08

申请号：US17676505

申请日：2022-02-21

Applicant: IBIDEN CO., LTD.

Inventor： Tomohiko MURATA ,  Yoshiteru HASHIMOTO ,  Yoshiki KAWAI ,  Hideyuki GOTO

IPC: H05K1/02

Abstract: A printed wiring board includes a first insulating layer, a conductor layer, and a second insulating layer. The conductor layer includes first and second circuits such that space is formed between the circuits, the first circuit has first and second side walls, the second circuit has third and fourth side walls such that the second wall faces the third wall, the first circuit has first, second and third portions, the second circuit has fourth, fifth and sixth portions such that the first and fourth portions, the second and fifth portions and the third and sixth portions face each other, the first circuit is formed such that the second wall of the second portion is recessed from the second wall of the first and third portions, and the first insulating layer has recess between the second and fifth portions such that the second insulating layer is filling the space and recess.

公开(公告)号：US20230063719A1

公开(公告)日：2023-03-02

申请号：US17822265

申请日：2022-08-25

Applicant: IBIDEN CO., LTD.

Inventor： Michimasa TAKAHASHI ,  Hideyuki GOTO ,  Kiyohiro ISHIKAWA ,  Ayami OHNO

IPC: H05K3/00 ,  H05K1/11 ,  H05K3/04 ,  H05K3/02 ,  H05K3/26

Abstract: A method for manufacturing a wiring substrate includes preparing a substrate including an insulating layer and metal foils, forming a through hole in the substrate to penetrate through the insulating layer and foils, forming a first plating film on the substrate such that the first film is formed on the entire surface of each metal foil and the inner wall of the hole, laminating one or more resin sheets on the first film such that the resin sheet or sheets cover the first film on the entire surface of a respective one of the foils, pressing the resin sheet or sheets such that resin is extruded from the resin sheet or sheets into the hole and fills space surrounded by the first film inside the hole, removing the resin sheet or sheets, and forming a second plating film on the substrate to cover surface of the resin in the hole.