公开(公告)号：US20240268021A1

公开(公告)日：2024-08-08

申请号：US18434910

申请日：2024-02-07

Applicant: IBIDEN CO., LTD.

Inventor： Susumu KAGOHASHI ,  Kiyohiro ISHIKAWA

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/11 ,  H05K3/16

CPC classification number: H05K1/05 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2203/0723

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first particles, second particles, third particles and fourth particles formed such that the first and second particles are solid particles, the third and fourth particles are hollow particles, the first and third particles form an inner wall surface of the opening in the resin insulating layer, the second and fourth particles are embedded in the resin insulating layer, the first particles have shapes that are different from shapes of the second particles, and the third particles have shapes that are different from shapes of the fourth particles.

公开(公告)号：US20230063719A1

公开(公告)日：2023-03-02

申请号：US17822265

申请日：2022-08-25

Applicant: IBIDEN CO., LTD.

Inventor： Michimasa TAKAHASHI ,  Hideyuki GOTO ,  Kiyohiro ISHIKAWA ,  Ayami OHNO

IPC: H05K3/00 ,  H05K1/11 ,  H05K3/04 ,  H05K3/02 ,  H05K3/26

Abstract: A method for manufacturing a wiring substrate includes preparing a substrate including an insulating layer and metal foils, forming a through hole in the substrate to penetrate through the insulating layer and foils, forming a first plating film on the substrate such that the first film is formed on the entire surface of each metal foil and the inner wall of the hole, laminating one or more resin sheets on the first film such that the resin sheet or sheets cover the first film on the entire surface of a respective one of the foils, pressing the resin sheet or sheets such that resin is extruded from the resin sheet or sheets into the hole and fills space surrounded by the first film inside the hole, removing the resin sheet or sheets, and forming a second plating film on the substrate to cover surface of the resin in the hole.