公开(公告)号：US20150061814A1

公开(公告)日：2015-03-05

申请号：US14475950

申请日：2014-09-03

Applicant: IBIS INNOTECH INC.

Inventor： Wei-Jen LAI ,  Chih-Kung HUANG

IPC: H01F27/28

CPC classification number: H05K1/0306 ,  H01F27/2804 ,  H01L23/15 ,  H01L23/49838 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K2201/0175 ,  H01L2924/00

Abstract: A ferrite circuit board includes a substrate and a wire. The substrate is made of ferrite and provided with a surface and an elongated groove recessed from the surface. The elongated groove has an inner wall having a roughness Ra ranging from 0.1 μm to 20 μm. The wire is embedded in the elongated groove of the substrate, such that the wire is not easily separated from the substrate. The ferrite circuit board can be used as an inductor to provide abundant functionality.

Abstract translation: 铁氧体电路板包括基板和导线。 基板由铁氧体制成，并具有从表面凹陷的表面和细长槽。 细长槽具有表面粗糙度Ra为0.1μm〜20μm的内壁。 导线被嵌入基板的细长槽中，使得导线不容易与基板分离。 铁氧体电路板可用作电感器以提供丰富的功能。

公开(公告)号：US20160034083A1

公开(公告)日：2016-02-04

申请号：US14581835

申请日：2014-12-23

Applicant: IBIS INNOTECH INC.

Inventor： Wei-Jen LAI ,  Chih-Kung HUANG

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103

Abstract: A touch sensing device includes a light-transmitting substrate, an edge layer and sensing lines. The light-transmitting substrate has an upper surface and a lower surface opposite to the upper surface, and the edge layer is covered on an edge of the upper surface of the light-transmitting substrate. The edge layer has a main body made of insulated material, and conductive wires. The main body has a first surface attached on the upper surface of the light-transmitting substrate, a second surface opposite and parallel to the first surface, and slots recessed downwardly from the second surface. The conductive wires are embedded in the slots, respectively. The sensing lines are disposed on the upper surface of the light-transmitting substrate and electrically connected with the conductive wires, respectively. Therefore, the touch sensing device can have simple and quick manufacturing process, high yield rate and low cost.

Abstract translation: 触摸感测装置包括透光衬底，边缘层和感测线。 透光基板具有与上表面相对的上表面和下表面，并且边缘层被覆盖在透光基板的上表面的边缘上。 边缘层具有由绝缘材料制成的主体和导电线。 主体具有附着在透光基板的上表面上的第一表面，与第一表面相对并平行的第二表面，以及从第二表面向下凹陷的槽。 导线分别嵌入槽中。 感测线设置在透光基板的上表面上并分别与导电线电连接。 因此，触摸传感装置可以具有简单快速的制造工艺，高产率和低成本。

公开(公告)号：US20150060929A1

公开(公告)日：2015-03-05

申请号：US14171432

申请日：2014-02-03

Applicant: IBIS INNOTECH INC.

Inventor： Wei-Jen LAI

IPC: H05K1/03 ,  H01L33/48

CPC classification number: H05K1/0306 ,  H01F27/2804 ,  H01L23/15 ,  H01L23/49838 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K2201/0175 ,  H01L2924/00

Abstract: A ceramic circuit board includes a substrate made of Al2O3 or AlN and having an exterior surface and a groove recessed from the exterior surface. The groove has a bottom surface provided with a roughness Ra of 1-20 μm, a plurality of crests and a plurality of troughs. The crests are located in an imaginary plane separated from the exterior surface at a distance of 1-100 μm. An electro-conductive wire is embedded in the groove and has a top surface flush with the exterior surface. An LED package module includes a ceramic circuit board having two embedded electro-conductive wires, two bonding pads respectively mounted on the top surfaces of the wires, and an LED chip having two contacts electrically connected with the bonding pads respectively. The electro-conductive wire is connected with the substrate firmly and made relatively thicker capable of carrying a relatively larger electric current.

Abstract translation: 陶瓷电路板包括由Al 2 O 3或AlN制成并具有外表面和从外表面凹陷的凹槽的基底。 凹槽具有设置有1-20μm粗糙度Ra，多个波峰和多个槽的底表面。 波峰位于与外表面隔开的虚拟平面上，距离为1-100μm。 导电线嵌入槽中并具有与外表面齐平的顶表面。 LED封装模块包括具有两个嵌入式导电线的陶瓷电路板，分别安装在导线顶表面上的两个焊盘，以及分别与焊盘电连接的两个触点的LED芯片。 导电线牢固地与基板连接，并且能够承载相对较大电流的相对较厚。