公开(公告)号：US3339704A

公开(公告)日：1967-09-05

申请号：US45938065

申请日：1965-05-27

Applicant: IBM

Inventor： KENDALL CLARK ,  CREIGHTON EUGENE J ,  DROP JOSEPH G ,  SANTILLO JR GEORGE R

IPC: H01L21/00 ,  H01L21/68

CPC classification number: H01L21/67144 ,  H01L21/68

公开(公告)号：US3915770A

公开(公告)日：1975-10-28

申请号：US53303674

申请日：1974-12-16

Applicant: IBM

Inventor： SANTILLO JR GEORGE R

IPC: B26F3/00 ,  B28D5/00 ,  B28D5/02 ,  B28D5/04 ,  C04B41/53 ,  C23F1/02 ,  C30B33/00 ,  H01L21/304

CPC classification number: C04B41/5353 ,  B28D5/00 ,  C23F1/02

Abstract: Disclosed is a method and apparatus for thermochemically slicing wafers from a crystal boule by propelling a continuous flow of an acid etching solution against a heated wire which is adjacent the intended line of etch while providing for relative movement between the boule and the chemical etching solution to thereby effect a slicing action of the boule.

Abstract translation: 公开了一种用于通过将酸蚀刻溶液的连续流动相对于预期蚀刻线附近的加热线推进而对晶片进行热化学切片的方法和装置，同时提供所述晶粒和化学蚀刻溶液之间的相对运动， 从而影响该坯料的切片动作。