公开(公告)号：US09645058B2

公开(公告)日：2017-05-09

申请号：US14413715

申请日：2013-07-16

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： Lawrence L. Freson ,  Kurt G. Adair ,  Charles E. Shewey ,  Douglas A. Ceckowski ,  Sean O'Flaherty ,  Anatoly Gosis ,  Yury Shkolnikov ,  Michael F. Hart ,  Daniel P. Schmidt

IPC: G01N1/22 ,  G01N1/36 ,  B30B11/02 ,  B30B15/34 ,  B30B11/04 ,  G01K13/00

CPC classification number: G01N1/36 ,  B30B11/02 ,  B30B11/04 ,  B30B15/34 ,  G01K13/00 ,  G01N2001/364

Abstract: A sample encapsulation system includes a base, a chamber having an inlet and a chamber housing in which the chamber is housed. The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to the cap for engaging the chamber inlet and a second ram positioned in the chamber opposite the inlet. The second ram is movable toward and away from the first ram. The chamber and housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle. The system includes heating and cooling assemblies and a temperature sensor located remotely from the chamber interior to automatically isolate cooling water to the system.

公开(公告)号：US20150143928A1

公开(公告)日：2015-05-28

申请号：US14413715

申请日：2013-07-16

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： Lawrence L. Freson ,  Kurt G. Adair ,  Charles E. Shewey ,  Douglas A. Ceckowski ,  Sean O'Flaherty ,  Anatoly Gosis ,  Yury Shkolnikov ,  Michael F. Hart ,  Daniel P. Schmidt

IPC: G01N1/36 ,  G01K13/00

CPC classification number: G01N1/36 ,  B30B11/02 ,  B30B11/04 ,  B30B15/34 ,  G01K13/00 ,  G01N2001/364

Abstract: A sample encapsulation system includes a base, a chamber having an inlet and a chamber housing in which the chamber is housed. The chamber is fixedly mounted at least in part within the housing and the housing is movably mounted to the base. The system includes a cap, a first ram operably mounted to the cap for engaging the chamber inlet and a second ram positioned in the chamber opposite the inlet. The second ram is movable toward and away from the first ram. The chamber and housing are movable toward the cap for engaging the first ram with the chamber inlet during an encapsulation cycle and away from the cap, disengaging the first ram from the chamber inlet following an encapsulation cycle. The system includes heating and cooling assemblies and a temperature sensor located remotely from the chamber interior to automatically isolate cooling water to the system.

Abstract translation: 样品封装系统包括基座，具有入口和腔室的腔室，腔室容纳在腔室中。 腔室至少部分地固定地安装在壳体内，壳体可移动地安装到基座上。 该系统包括一个盖子，一个可操作地安装到盖上用于接合室入口的第一柱塞和一个位于与入口相对的腔室中的第二压头。 第二压头可以朝向和远离第一压头移动。 腔室和壳体可朝向盖运动，用于在封装周期期间使第一压头与腔室入口接合，并且远离帽，在封装周期之后将第一压头与腔室入口分离。 该系统包括加热和冷却组件以及远离室内部的温度传感器，以将冷却水自动隔离到系统中。