公开(公告)号：US20230352615A1

公开(公告)日：2023-11-02

申请号：US18065918

申请日：2022-12-14

Applicant: IMEC VZW

Inventor： Pieter Bex ,  Alain Phommahaxay

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L25/0753 ,  H01L33/486 ,  H01L2933/0066

Abstract: The present disclosure provides that a plurality of dies are temporarily attached to a rigid transfer substrate through a light-releasable temporary bonding layer. The transfer substrate is a rigid substrate that is transparent for the type of light that is capable of releasing the dies, i.e. the type of light that is capable of removing or releasing the light-releasable layer. This may be laser light or other visible or invisible light such as UV, IR or LED light. The assembly comprising the transfer substrate and the dies is positioned relative to a carrier substrate with the dies facing respective interface areas on a surface of the carrier substrate. By illuminating a die through the back side of the transfer substrate, the die is released and transferred to the carrier substrate. The method is suitable for bonding dies to a carrier without any mechanical handling of individual dies.