CELL MODULE
    2.
    发明公开
    CELL MODULE 审中-公开

    公开(公告)号:US20240304741A1

    公开(公告)日:2024-09-12

    申请号:US18525139

    申请日:2023-11-30

    CPC classification number: H01L31/0481

    Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.

    CELL MODULE
    3.
    发明申请

    公开(公告)号:US20250056901A1

    公开(公告)日:2025-02-13

    申请号:US18928788

    申请日:2024-10-28

    Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a crosslinked polymer layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The crosslinked polymer layer includes a crosslinked polymer, and the crosslinked polymer has a crosslinking degree of from 35.4 to 67.4%.

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