Abstract:
The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.
Abstract:
A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I)
wherein n is 8 to 232, wherein R1 is independently C1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II)
wherein x≥2, y≥2, and x/y is between 0.1 and 3, and R2, R3 and R4 are independently C1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III)
and 90 to 250 parts by mole of a curing agent represented by Formula (IV)
wherein m is 7 to 230, wherein R5 is independently C1-3 alkyl group.
Abstract:
The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.
Abstract:
Disclosed is an organic light emitting diode (OLED), including a flexible substrate having a surface with a bulge and groove structure. The OLED also includes a first electrode on the flexible substrate, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer. The flexible substrate includes polyimide.