SUBSTRATE STRUCTURE FOR ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF
    1.
    发明申请
    SUBSTRATE STRUCTURE FOR ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF 审中-公开
    电子设备的基板结构及其制造方法

    公开(公告)号:US20160181553A1

    公开(公告)日:2016-06-23

    申请号:US14578705

    申请日:2014-12-22

    Abstract: The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.

    Abstract translation: 本公开提供了一种用于电子元件的衬底结构,其包括支撑载体; 释放层,其表面上具有第一微结构,并且所述释放层具有对所述支撑载体的第一粘附; 以及用于在其上设置支撑载体和释放层的柔性基板,其中柔性基板具有对剥离层的第二粘附,第一粘合力大于第二粘合力,并且柔性基板的与表面接触的表面 释放层具有与第一微结构相对的第二微结构。 本公开还提供了一种用于制造衬底结构的方法。

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