Abstract:
A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.
Abstract:
A siloxane resin and photoelectric device employing the same are provided. The siloxane resin composition includes (a) 45-87 parts by weight of a first siloxane compound represented by Formula (I), wherein each R1 is independently C1-3 alkyl group, and n is an integer from 2 to 15; (b) 5-35 parts by weight of a second siloxane compound represented by Formula (II), wherein each R2 and R3 are independently C1-3 alkyl group; each R4 is independently C1-3 alkyl group, or epoxy group; x≧1, y≧2, and x/y is from about 0.1 to 3; and (c) 2-20 parts by weight of a third siloxane compound represented by Formula (III), wherein each R5 is independently C1-3 alkyl group, and the sum of the first siloxane compound, the second siloxane compound, and the third siloxane compound is 100 parts by weight
Abstract:
An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.
Abstract:
A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I)
wherein n is 8 to 232, wherein R1 is independently C1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II)
wherein x≥2, y≥2, and x/y is between 0.1 and 3, and R2, R3 and R4 are independently C1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III)
and 90 to 250 parts by mole of a curing agent represented by Formula (IV)
wherein m is 7 to 230, wherein R5 is independently C1-3 alkyl group.
Abstract:
An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.
Abstract:
In one embodiment, an organic-inorganic metal oxide hybrid resin having the following formula: wherein each R1 is independently a substituted or non-substituted C1 to C10 alkyl group; each R2 is independently a substituted or non-substituted C1 to C10 alkyl group or benzyl group; n is a positive integer from 3 to 30; and each Y is independently (MO4/2)l[(MO)(4-a)/2M(OH)a/2]m[MO(4-b)/2M(OZ)b/2]p, wherein M is a metal; l is a positive integer from 10 to 90; m is a positive integer from 2 to 20; p is a positive integer from 4 to 15; a is a positive integer from 1 to 2; b is a positive integer from 1 to 2; and Z is an organosilane group.