公开(公告)号：US09864146B1

公开(公告)日：2018-01-09

申请号：US15356438

申请日：2016-11-18

Applicant: INPHI CORPORATION

Inventor： Pei-Keng Fu ,  Chris Kiyoshi Togami ,  Masaki Kato ,  Radhakrishnan L. Nagarajan

IPC: G02B6/30 ,  G02B6/36 ,  G02B6/38

CPC classification number: G02B6/30 ,  G02B6/3636 ,  G02B6/3893

Abstract: An apparatus for handling a fiber-array to be attached with a silicon-photonics chip. The apparatus includes a bottom-plate having a first trench formed with two first branches connected to two first recessed regions at a first end and one second branch straight to a second end thereof and a second trench sharing the same second branch and having two third branches connected to two second recessed regions with an angle towards two sides outside the two first branches. The bottom-plate includes many female clip structures located at the first end, the second end, and the two sides. The apparatus includes a top-plate having corresponding male clip structures configured to lock with the female clip structures to at least have two shaped cavities at the first end for firmly holding fiber ferrules of the fiber-array substantially without lateral and axial motion while leaving excess lengths of fibers outside the second end.