公开(公告)号：US20240361528A1

公开(公告)日：2024-10-31

申请号：US18766557

申请日：2024-07-08

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Zhicheng Qiu ,  Xiaofeng Tang ,  Pengcheng Xiao

IPC分类号： G02B6/30

CPC分类号： G02B6/30

摘要： An optical component, an optical module, and a communication device are provided. The optical component includes a chip (11), a fiber array unit (12), and at least one fastener (13). The fiber array unit (12) is located on a side of the chip (11), the fiber array unit (12) includes at least one optical fiber (121), at least one waveguide (141) is disposed on a surface of the chip (11), and matching glue is filled between an end face of the waveguide (141) and an end face of the optical fiber (121). One end of the fastener (13) is bonded to the chip (11) by using fastening glue, and the other end is bonded to the fiber array unit (12) by using the fastening glue. Bonding strength of the fastening glue is greater than bonding strength of the matching glue.

公开(公告)号：US12117650B2

公开(公告)日：2024-10-15

申请号：US18448429

申请日：2023-08-11

申请人： Cisco Technology, Inc.

发明人： Shiyi Chen ,  Tao Ling ,  Weizhuo Li ,  Mark A. Webster

IPC分类号： G02B6/293 ,  G02B6/02 ,  G02B6/124 ,  G02B6/30 ,  G02B6/35 ,  G02B6/12 ,  G02B6/122 ,  G02B6/42

CPC分类号： G02B6/29304 ,  G02B6/02261 ,  G02B6/124 ,  G02B6/2931 ,  G02B6/29311 ,  G02B6/30 ,  G02B6/3514 ,  G02B6/3526 ,  G02B2006/12102 ,  G02B2006/12111 ,  G02B6/1225 ,  G02B6/4214

摘要： Embodiments include a fiber to photonic chip coupling system including a collimating lens which collimate a light transmitted from a light source and an optical grating including a plurality of grating sections. The system also includes an optical dispersion element which separates the collimated light from the collimating lens into a plurality of light beams and direct each of the plurality of light beams to a respective section of the plurality of grating sections. Each light beam in the plurality of light beams is diffracted from the optical dispersion element at a different wavelength a light beam of the plurality of light beams is directed to a respective section of the plurality of grating sections at a respective incidence angle based on the wavelength of the light beam of the plurality of light beams to provide optimum grating coupling.

公开(公告)号：US12111500B2

公开(公告)日：2024-10-08

申请号：US17615259

申请日：2019-06-03

申请人： Nippon Telegraph and Telephone Corporation

发明人： Kota Shikama ,  Atsushi Aratake

IPC分类号： G02B6/36 ,  G02B6/30

CPC分类号： G02B6/3608 ,  G02B6/30 ,  G02B6/3644

摘要： An optical fiber guide structure includes a guide member that is configured to be erected on a connection end surface of an optical waveguide device and forms a space for accommodating a leading end portion of an optical fiber to be connected to the optical waveguide device. The guide member is formed of an elastically deformable material, and in a specific region a longitudinal direction of the guide member, and a diameter of an inscribed circle in contact with an inner wall of the guide member in a plane perpendicular to the longitudinal direction is smaller than an outer diameter of the optical fiber.

公开(公告)号：US12092873B2

公开(公告)日：2024-09-17

申请号：US17587194

申请日：2022-01-28

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Sae-Kyoung Kang ,  Joon Young Huh ,  Joon Ki Lee

IPC分类号： G02B6/30

CPC分类号： G02B6/30

摘要： An optical fiber coupler includes a plurality of optical fibers parallel to each other in a first direction, an optical fiber array block (FAB) configured to maintain a constant center-to-center distance between the plurality of optical fibers, and an optical waveguide block including a plurality of optical waveguides coupled to the plurality of optical fibers, respectively, and configured to transfer optical signals transmitted through the plurality of optical fibers connected to the optical FAB in a second direction in which a photonics chip is placed and which is different from the first direction.

公开(公告)号：US20240280747A1

公开(公告)日：2024-08-22

申请号：US18651225

申请日：2024-04-30

申请人： Celestial AI, Inc.

发明人： Martinus Bos ,  Philip Winterbottom

IPC分类号： G02B6/12 ,  G02B6/30 ,  G02B6/43 ,  G06F7/50 ,  G06F7/53 ,  G06F7/544 ,  G06N3/04 ,  G06N3/067

CPC分类号： G02B6/12004 ,  G02B6/12002 ,  G02B6/30 ,  G02B6/43 ,  G06F7/50 ,  G06F7/5318 ,  G06F7/5443 ,  G06N3/04 ,  G06N3/067 ,  G06N3/0675

摘要： Electro-photonic networks, including a plurality of processing elements connected by bidirectional photonic channels, suited for implementing neural-network models. Weights of the model may be preloaded into memory of the processing elements based on assignments of neural nodes to processing elements implementing them, and routers of the processing elements can be configured to stream activations between the processing elements based on a predetermined flow of activations in the model.

公开(公告)号：US20240272380A1

公开(公告)日：2024-08-15

申请号：US18634911

申请日：2024-04-13

申请人： Apple Inc.

发明人： Alexander Goldis ,  Jeffrey T. Hill ,  Michael J. Bishop

IPC分类号： G02B6/42 ,  G02B6/30 ,  G02B19/00

CPC分类号： G02B6/4204 ,  G02B6/4206 ,  G02B6/4219 ,  G02B6/4244 ,  G02B6/4296 ,  G02B19/0057 ,  G02B6/30 ,  G02B6/4262

摘要： A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.

公开(公告)号：US12050348B2

公开(公告)日：2024-07-30

申请号：US18448032

申请日：2023-08-10

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Chen-Hao Huang ,  Hau-Yan Lu ,  Sui-Ying Hsu ,  Yuehying Lee ,  Chien-Ying Wu ,  Chien-Chang Lee ,  Chia-Ping Lai

IPC分类号： G02B6/34 ,  G02B6/30 ,  G02B6/42

CPC分类号： G02B6/34 ,  G02B6/30 ,  G02B6/4204

摘要： A method of making a chip includes depositing a first polysilicon layer on a top surface and a bottom surface of a substrate. The method further includes patterning the first polysilicon layer to define a recess, wherein the first polysilicon layer is completed removed from the recess. The method further includes implanting dopants into the substrate to define an implant region. The method further includes depositing a contact etch stop layer (CESL) in the recess, wherein the CESL covers the implant region. The method further includes patterning the CESL to define a CESL block. The method further includes forming a waveguide and a grating in the substrate. The method further includes forming an interconnect structure over the waveguide, the grating and the CESL block. The method further includes etching the interconnect structure to define a cavity aligned with the grating.

公开(公告)号：US20240233282A1

公开(公告)日：2024-07-11

申请号：US18197844

申请日：2023-05-16

申请人： Luxshare Precision Technology (Nanjing) Co., LTD

发明人： Liyuan CHANG ,  Cheng WANG ,  Guojun XU

IPC分类号： G06T19/00 ,  G02B6/10 ,  G02B6/30

CPC分类号： G06T19/006 ,  G02B6/10 ,  G02B6/30

摘要： An augmented reality display system includes a body, an image source device configured to output image information, an optical waveguide device configured to receive the image information, and an optical fiber array image transmission bundle. The optical fiber array image transmission bundle includes a number of optical fibers. Each optical fiber includes an input end and an output end. Each input end is coupled with a first microlens protruding outward, and each output end is coupled with a second microlens protruding outward. The image information output by the image source device is coupled into the optical fiber array image transmission bundle through the first microlenses for total reflection, and then collimated by the second microlenses and emitted directly to the optical waveguide device. An augmented reality display device having the augmented reality display system is also disclosed.

公开(公告)号：US20240201436A1

公开(公告)日：2024-06-20

申请号：US18590689

申请日：2024-02-28

申请人： Celestial AI Inc.

发明人： Philip Winterbottom ,  Martinus Bos

IPC分类号： G02B6/12 ,  G02B6/30 ,  G02B6/43 ,  G06F7/50 ,  G06F7/53 ,  G06F7/544 ,  G06N3/04 ,  G06N3/067

CPC分类号： G02B6/12004 ,  G02B6/12002 ,  G02B6/30 ,  G02B6/43 ,  G06F7/50 ,  G06F7/5318 ,  G06F7/5443 ,  G06N3/04 ,  G06N3/067 ,  G06N3/0675

摘要： Various embodiments provide for electro-photonic networks, including a plurality of processing elements connected by bidirectional photonic channels, suited for implementing neural-network models. Weights of the model may be preloaded into memory of the processing elements based on assignments of neural nodes to processing elements implementing them, and routers of the processing elements can be configured to stream activations between the processing elements based on a predetermined flow of activations in the model.

公开(公告)号：US20240176081A1

公开(公告)日：2024-05-30

申请号：US18432768

申请日：2024-02-05

申请人： Ayar Labs, Inc.

发明人： Chong Zhang ,  Roy Edward Meade

IPC分类号： G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L25/00 ,  H01L25/18 ,  H05K1/02

CPC分类号： G02B6/42 ,  G02B6/30 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/4274 ,  H01L23/5389 ,  H01L25/18 ,  H01L25/50 ,  H05K1/0274 ,  G02B6/428 ,  G02B6/43 ,  H05K2201/10121

摘要： A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.