公开(公告)号：US10321573B2

公开(公告)日：2019-06-11

申请号：US15855808

申请日：2017-12-27

Applicant: INTEL CORPORATION

Inventor： Fay Hua ,  Hong Xie ,  Gregorio R. Murtagian ,  Amit Abraham ,  Alan C. McAllister ,  Ting Zhong

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/18 ,  H01R12/52 ,  H01L23/498 ,  H01R33/76 ,  H05K3/34

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

公开(公告)号：US09860988B2

公开(公告)日：2018-01-02

申请号：US14780501

申请日：2014-12-20

Applicant: INTEL CORPORATION

Inventor： Fay Hua ,  Hong Xie ,  Gregorio R. Murtagian ,  Amit Abraham ,  Alan C. Mcallister ,  Ting Zhong

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/52 ,  H01L23/498 ,  H01R33/76 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/00 ,  H01R12/52 ,  H01R33/7607 ,  H05K3/3421 ,  H05K3/4007 ,  H05K2201/10719

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.