公开(公告)号：US10044115B2

公开(公告)日：2018-08-07

申请号：US14757626

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Donald T. Tran ,  Gregorio Murtagian ,  Kuang Liu ,  Srikant Nekkanty ,  Feroz Mohammad ,  Karumbu Meyyappan ,  Hong Xie ,  Russell S. Aoki ,  Gaurav Chawla

IPC: H01R4/50 ,  H01R13/639 ,  H01R4/52 ,  H01R13/508 ,  H01R12/85 ,  H01R12/72

Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

公开(公告)号：US10321573B2

公开(公告)日：2019-06-11

申请号：US15855808

申请日：2017-12-27

Applicant: INTEL CORPORATION

Inventor： Fay Hua ,  Hong Xie ,  Gregorio R. Murtagian ,  Amit Abraham ,  Alan C. McAllister ,  Ting Zhong

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/18 ,  H01R12/52 ,  H01L23/498 ,  H01R33/76 ,  H05K3/34

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

公开(公告)号：US09860988B2

公开(公告)日：2018-01-02

申请号：US14780501

申请日：2014-12-20

Applicant: INTEL CORPORATION

Inventor： Fay Hua ,  Hong Xie ,  Gregorio R. Murtagian ,  Amit Abraham ,  Alan C. Mcallister ,  Ting Zhong

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/52 ,  H01L23/498 ,  H01R33/76 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/00 ,  H01R12/52 ,  H01R33/7607 ,  H05K3/3421 ,  H05K3/4007 ,  H05K2201/10719

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.