公开(公告)号：US20200006203A1

公开(公告)日：2020-01-02

申请号：US16020122

申请日：2018-06-27

Applicant: INTEL CORPORATION

Inventor： Brandon MARIN ,  Whitney BRYKS

IPC: H01L23/492 ,  H01L23/498

Abstract: A package substrate may include a build-up layer. The build-up layer may include a dielectric material and one or more microspheres. The one or more microspheres may include a magnetic core that includes a first material that is a first oxidation-resistant material. Further, the one or more microspheres may include a shell to encapsulate the core, and the shell may include a second material that is a second oxidation-resistant material. The package substrate may further include a metal layer coupled with the build-up layer.