公开(公告)号：US20230025921A1

公开(公告)日：2023-01-26

申请号：US17957175

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Devdatta Kulkarni ,  Alexey Chinkov ,  Brian Jarrett ,  Jeff King ,  John Gulick

IPC: H05K7/20

Abstract: Cold plates and liquid cooling systems for electronic devices are disclosed herein. An example cold plate includes a body defining a cavity. The body has an inlet opening and an outlet opening fluidically coupled to the cavity such that a fluid passageway is defined between the inlet opening and the outlet opening. The cold plate also includes metal foam in the cavity.

公开(公告)号：US11608919B2

公开(公告)日：2023-03-21

申请号：US16287418

申请日：2019-02-27

Applicant: INTEL CORPORATION

Inventor： Mark Sprenger ,  Joseph Broderick ,  Aaron Anderson ,  Kenan Arik ,  Brian Jarrett

IPC: F16L37/08 ,  F16L29/04 ,  F16L37/60 ,  F16L37/23 ,  F16L37/084 ,  F16L37/00

Abstract: Couplings are disclosed herein. A plug of a coupling includes a plug body and a socket interface coupled to the plug body. The socket interface includes a shoulder extending axially outward from the plug body, a neck extending axially outward and radially inward from the shoulder, and a socket guide extending axially outward and radially outward from the neck.