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    Fastenerless hinge which enables thin form factor low cost design
    1.
    发明授权
    Fastenerless hinge which enables thin form factor low cost design 有权

    公开(公告)号：US10435932B2

    公开(公告)日：2019-10-08

    申请号：US15609010

    申请日：2017-05-31

    Applicant: INTEL CORPORATION

    Inventor： Mark E. Sprenger ,  Kenan Arik ,  Drew G. Damm

    IPC: E05D7/10 ,  G06F1/16

    Abstract: The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.

    360 degree hinge assembly for electronic devices
    3.
    发明授权
    360 degree hinge assembly for electronic devices 有权

    公开(公告)号：US09990006B2

    公开(公告)日：2018-06-05

    申请号：US15163165

    申请日：2016-05-24

    Applicant: Intel Corporation

    Inventor： Mark E. Sprenger ,  Kenan Arik ,  Aleksander Magi ,  David A. Rittenhouse

    IPC: G06F1/16

    CPC classification number: G06F1/1681 ,  G06F1/1616 ,  Y10T16/54038

    Abstract: In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.

    Spill resistant chassis for electronic device
    4.
    发明授权
    Spill resistant chassis for electronic device 有权

    公开(公告)号：US09785194B2

    公开(公告)日：2017-10-10

    申请号：US14864573

    申请日：2015-09-24

    Applicant: Intel Corporation

    Inventor： Mark E. Sprenger ,  Paul J. Gwin ,  Kenan Arik

    IPC: G06F1/16 ,  H05K7/00

    CPC classification number: G06F1/1656 ,  G06F1/1662 ,  H01H13/86 ,  H01H2223/044

    Abstract: In one example an electronic device comprises at least one electronic component and a body formed from a rigid material and comprising a first major surface and a second major surface opposite the first major surface, the body comprising at least one aperture extending between the first major surface and the second major surface and a cover formed from a semi-rigid material extending over the at least one aperture, wherein a portion of the cover extends through the aperture and is connected to the second major surface of the body. Other examples may be described.

    360 DEGREE HINGE ASSEMBLY FOR ELECTRONIC DEVICES
    6.
    发明申请
    360 DEGREE HINGE ASSEMBLY FOR ELECTRONIC DEVICES 有权

    公开(公告)号：US20170344074A1

    公开(公告)日：2017-11-30

    申请号：US15163165

    申请日：2016-05-24

    Applicant: Intel Corporation

    Inventor： Mark E. Sprenger ,  Kenan Arik ,  Aleksander Magi ,  David A. Rittenhouse

    IPC: G06F1/16

    CPC classification number: G06F1/1681 ,  G06F1/1616 ,  Y10T16/54038

    Abstract: In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.

    SPILL RESISTANT CHASSIS FOR ELECTRONIC DEVICE
    7.
    发明申请
    SPILL RESISTANT CHASSIS FOR ELECTRONIC DEVICE 有权

    公开(公告)号：US20170090520A1

    公开(公告)日：2017-03-30

    申请号：US14864573

    申请日：2015-09-24

    Applicant: Intel Corporation

    Inventor： Mark E. Sprenger ,  Paul J. Gwin ,  Kenan Arik

    IPC: G06F1/16

    CPC classification number: G06F1/1656 ,  G06F1/1662 ,  H01H13/86 ,  H01H2223/044

    Abstract: In one example an electronic device comprises at least one electronic component and a body formed from a rigid material and comprising a first major surface and a second major surface opposite the first major surface, the body comprising at least one aperture extending between the first major surface and the second major surface and a cover formed from a semi-rigid material extending over the at least one aperture, wherein a portion of the cover extends through the aperture and is connected to the second major surface of the body. Other examples may be described.

    Flexible thermally-conductive shunt
    8.
    发明授权
    Flexible thermally-conductive shunt 有权

    公开(公告)号：US10321606B2

    公开(公告)日：2019-06-11

    申请号：US15471798

    申请日：2017-03-28

    Applicant: Intel Corporation

    Inventor： Mark E. Sprenger ,  Kenan Arik ,  Michael S. Brazel

    IPC: H05K7/20 ,  F28F1/40 ,  G06F1/20

    Abstract: Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.

    Fastenerless Hinge which Enables Thin Form Factor Low Cost Design
    10.
    发明申请
    Fastenerless Hinge which Enables Thin Form Factor Low Cost Design 有权
    紧凑型铰链，可实现薄型元件低成本设计

    公开(公告)号：US20160378146A1

    公开(公告)日：2016-12-29

    申请号：US14752938

    申请日：2015-06-27

    Applicant: Intel Corporation

    Inventor： Mark E. Sprenger ,  Kenan Arik ,  Drew G. Damm

    IPC: G06F1/16

    CPC classification number: E05D7/1061 ,  E05D7/10 ,  G06F1/16 ,  G06F1/1616 ,  G06F1/1681 ,  Y10T16/554

    Abstract: The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.

    Abstract translation: 本公开包括无紧固件铰链系统，其能够实现薄的形状因子低成本设计。 本文描述的铰链系统可以包括铰链支架和铰链翼。 铰链托架包括提升部分，从而提供中空区域和一个或多个弹簧片。 铰链翼通过中空部分可滑动地联接到铰链支架。 有利地，与本公开一致的铰链系统不包括紧固件，使得除了降低成本之外，计算装置的“Z”高度可以被最小化。

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