公开(公告)号：US20180156661A1

公开(公告)日：2018-06-07

申请号：US15786575

申请日：2017-10-17

Applicant: Intel Corporation

Inventor： Jonathan K. DOYLEND ,  David N. HUTCHISON ,  John HECK ,  Haisheng RONG ,  Daniel GRODENSKY ,  David ARBEL ,  Israel PETRONIUS

IPC: G01J1/42 ,  G01S7/481 ,  G01S17/10 ,  G02F1/29 ,  G01S17/42 ,  G01B11/22 ,  G01S17/88 ,  G01S7/484

CPC classification number: G01J1/4228 ,  G01B11/22 ,  G01S7/4813 ,  G01S7/4817 ,  G01S7/484 ,  G01S17/10 ,  G01S17/42 ,  G01S17/88 ,  G02F1/292

Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.

公开(公告)号：US20240151836A1

公开(公告)日：2024-05-09

申请号：US18548912

申请日：2022-03-18

Applicant: Intel Corporation

Inventor： Liron AIN-KEDEM ,  Avi MEDLINSKY ,  Daniel GRODENSKY ,  Shachar GREENBERG

IPC: G01S7/497 ,  G01S7/481 ,  G01S7/4911 ,  G01S7/4913 ,  G01S17/86

CPC classification number: G01S7/497 ,  G01S7/4815 ,  G01S7/4817 ,  G01S7/4911 ,  G01S7/4913 ,  G01S17/86

Abstract: Disclosed herein are methods, systems, and devices that relate to light detection and ranging (LIDAR). A controlling means for a LIDAR system includes a means for determining a current operational state of the LIDAR system regarding a predefined threshold state. The controlling means also switches the LIDAR system from a first operational mode to a second operational mode when the determined operational state exceeds the predefined threshold state. The second operational mode corresponds to an operational power of at least one operational means of the LIDAR system being lower than in the first operational mode.

公开(公告)号：US20230318247A1

公开(公告)日：2023-10-05

申请号：US17710881

申请日：2022-03-31

Applicant: INTEL cORPORATION

Inventor： Eleanor Patricia Paras RABADAM ,  Guiyun BAI ,  Sanjeev GUPTA ,  Ronald SPREITZER ,  Jonathan DOYLEND ,  Ankur AGRAWAL ,  Boping XIE ,  Sushrutha Reddy GUJJULA ,  Jason GARCIA ,  Kenneth BROWN ,  Dan WANG ,  Daniel GRODENSKY ,  Israel PETRONIUS ,  Konstantin MATYUCH

IPC: H01S3/04

CPC classification number: H01S3/0405

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

公开(公告)号：US20220342078A1

公开(公告)日：2022-10-27

申请号：US17640343

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： George RAKULJIC ,  Naresh SATYAN ,  Yaakov VILENCHIK ,  Ron FRIEDMAN ,  Daniel GRODENSKY ,  Israel PETRONIUS ,  Amnon YARIV

IPC: G01S17/931 ,  G01S7/481 ,  G02B6/12

Abstract: A photonic integrated circuit, comprising a semiconductor photonic substrate having integrated therein: at least one light receiving input; at least one optical splitter to branch light received at the at least one light receiving input to a first light path and a second light path; wherein, the photonic integrated circuit, in the first light path, includes: at least one first amplifier structure to amplify the light in the first light path to provide first amplified light; at least one first light output to output the first amplified light from the at least one first amplifier structure; and at least one first photo detector to receive light from the outside of the photonic integrated circuit, the at least one first photo detector being located next to the at least one first light output; wherein, the photonic integrated circuit, in the second light path, includes: at least one second amplifier structure to amplify the light in the second light path to provide second amplified light; at least one second light output to output the second amplified light from the at least one second amplifier structure; and at least one second photo detector to receive light from the outside of the photonic integrated circuit, the at least one second photo detector being located next to the at least one second light output.