公开(公告)号：US20210407909A1

公开(公告)日：2021-12-30

申请号：US17104963

申请日：2020-11-25

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Kenneth BROWN ,  David HUI ,  Ling LIAO ,  Syed S. ISLAM

IPC: H01L23/538 ,  G02B6/42 ,  H01L25/18 ,  H01L25/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.

公开(公告)号：US20220155539A1

公开(公告)日：2022-05-19

申请号：US16953146

申请日：2020-11-19

Applicant: Intel Corporation

Inventor： Srinivas V. PIETAMBARAM ,  Brandon C. MARIN ,  Sameer PAITAL ,  Sai VADLAMANI ,  Rahul N. MANEPALLI ,  Xiaoqian LI ,  Suresh V. POTHUKUCHI ,  Sujit SHARAN ,  Arnab SARKAR ,  Omkar KARHADE ,  Nitin DESHPANDE ,  Divya PRATAP ,  Jeremy ECTON ,  Debendra MALLIK ,  Ravindranath V. MAHAJAN ,  Zhichao ZHANG ,  Kemal AYGÜN ,  Bai NIE ,  Kristof DARMAWIKARTA ,  James E. JAUSSI ,  Jason M. GAMBA ,  Bryan K. CASPER ,  Gang DUAN ,  Rajesh INTI ,  Mozhgan MANSURI ,  Susheel JADHAV ,  Kenneth BROWN ,  Ankar AGRAWAL ,  Priyanka DOBRIYAL

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

公开(公告)号：US20210074866A1

公开(公告)日：2021-03-11

申请号：US16562889

申请日：2019-09-06

Applicant: Intel Corporation

Inventor： Priyanka DOBRIYAL ,  Ankur AGRAWAL ,  Susheel JADHAV ,  Quan TRAN ,  Raghuram NARAYAN ,  Raiyomand ASPANDIAR ,  Kenneth BROWN ,  John HECK

IPC: H01L31/0232 ,  G02B3/00 ,  H01L31/0216 ,  H01L31/02 ,  H01L25/16 ,  H01L23/538 ,  H01L31/18 ,  G02B1/11 ,  G02B6/42

Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.

公开(公告)号：US20230318247A1

公开(公告)日：2023-10-05

申请号：US17710881

申请日：2022-03-31

Applicant: INTEL cORPORATION

Inventor： Eleanor Patricia Paras RABADAM ,  Guiyun BAI ,  Sanjeev GUPTA ,  Ronald SPREITZER ,  Jonathan DOYLEND ,  Ankur AGRAWAL ,  Boping XIE ,  Sushrutha Reddy GUJJULA ,  Jason GARCIA ,  Kenneth BROWN ,  Dan WANG ,  Daniel GRODENSKY ,  Israel PETRONIUS ,  Konstantin MATYUCH

IPC: H01S3/04

CPC classification number: H01S3/0405

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

公开(公告)号：US20210210478A1

公开(公告)日：2021-07-08

申请号：US17191615

申请日：2021-03-03

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Juan DOMINGUEZ ,  Ankur AGRAWAL ,  Kenneth BROWN ,  Yi LI ,  Jing CHEN ,  Aditi MALLIK ,  Xiaoyu HONG ,  Thomas LILJEBERG ,  Andrew C. ALDUINO ,  Ling LIAO ,  David HUI ,  Ren-Kang CHIOU ,  Harinadh POTLURI ,  Hari MAHALINGAM ,  Lobna KAMYAB ,  Sasanka KANUPARTHI ,  Sushrutha Reddy GUJJULA ,  Saeed FATHOLOLOUMI ,  Priyanka DOBRIYAL ,  Boping XIE ,  Abiola AWUJOOLA ,  Vladimir TAMARKIN ,  Keith MEASE ,  Stephen KEELE ,  David SCHWEITZER ,  Brent ROTHERMEL ,  Ning TANG ,  Suresh POTHUKUCHI ,  Srikant NEKKANTY ,  Zhichao ZHANG ,  Kaiyuan ZENG ,  Baikuan WANG ,  Donald TRAN ,  Ravindranath MAHAJAN ,  Baris BICEN ,  Grant SMITH

IPC: H01L25/18 ,  H01L23/473 ,  H01R12/71

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.