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公开(公告)号:US20230207412A1
公开(公告)日:2023-06-29
申请号:US17561432
申请日:2021-12-23
Applicant: Intel Corporation
Inventor: Ronald SPREITZER , Jason GARCIA , Ankur AGRAWAL , Eleanor Patricia Paras RABADAM , Guiyun BAI
CPC classification number: H01L23/3157 , H01L24/16 , B81C1/00301 , H01L21/4853 , H01L21/563 , B81B7/007 , H01S5/0234 , H01S5/50 , B81B2207/07 , H01L2924/146 , H01L2224/16227 , H01L2924/1461 , H01L2924/18161
Abstract: Example techniques to enable a flip chip underfill exclusion zone include use of bump barriers, films or etched substrate cavities to prevent underfill from reaching the flip chip underfill exclusion zone.
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公开(公告)号:US20200276989A1
公开(公告)日:2020-09-03
申请号:US16649579
申请日:2017-12-20
Applicant: Intel Corporation
Inventor: Jason GARCIA , Tomer RIDER , Wenlong YANG
Abstract: Embodiments include apparatuses, methods, and systems for computer assisted or autonomous driving (CA/AD). An apparatus may include a trailer data collection unit and an automation level determination unit coupled with the trailer data collection unit. The trailer data collection unit may collect, from a trailer coupled with a CA/AD towing vehicle, trailer configuration data, including sensor configuration data for sensors disposed on the trailer. The automation level determination unit may determine a combined level of driving automation for the CA/AD towing vehicle and the trailer, based at least in part on the trailer configuration data, wherein the CA/AD towing vehicle alone has an initial level of driving automation. An apparatus for CA/AD may include a sensor configuration unit, a trailer configuration unit, and a communication interface coupled with the sensor configuration unit and the trailer configuration unit. Other embodiments may also be described and claimed.
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公开(公告)号:US20240346809A1
公开(公告)日:2024-10-17
申请号:US18574935
申请日:2022-01-07
Applicant: Intel Corporation
Inventor: Ping GUO , Mee Sim LAI , Kuan Heng LEE , Wee Hoo CHEAH , Jason GARCIA , Liang QIU , Peng WANG , Jiajie WU , Xiangbin WU
IPC: G06V10/776 , G06V10/70 , G06V10/77 , G06V10/774 , G06V10/82 , G06V20/40 , G09B19/00
CPC classification number: G06V10/776 , G06V10/768 , G06V10/7715 , G06V10/774 , G06V20/41 , G06V20/44 , G06V20/49 , G09B19/003 , G06V10/82
Abstract: The application provides an apparatus and a method for procedural video assessment. The apparatus includes: interface circuitry; and processor circuitry coupled to the interface circuitry and configured to: perform an action segmentation process for a procedural video received via the interface circuitry to obtain a plurality of action features associated with the procedure video; transform the plurality of action features into a plurality of action-procedure features based on an action-procedure relationship learning module for discovering a relationship between the plurality of action features and a plurality of scoring oriented procedures associated with the procedure video; and perform a procedure classification process to infer the plurality of scoring oriented procedures from the plurality of action-procedure features.
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公开(公告)号:US20230318247A1
公开(公告)日:2023-10-05
申请号:US17710881
申请日:2022-03-31
Applicant: INTEL cORPORATION
Inventor: Eleanor Patricia Paras RABADAM , Guiyun BAI , Sanjeev GUPTA , Ronald SPREITZER , Jonathan DOYLEND , Ankur AGRAWAL , Boping XIE , Sushrutha Reddy GUJJULA , Jason GARCIA , Kenneth BROWN , Dan WANG , Daniel GRODENSKY , Israel PETRONIUS , Konstantin MATYUCH
IPC: H01S3/04
CPC classification number: H01S3/0405
Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.
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