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1.发明申请Polishing Pad Containing Interpenetrating Liquified Vinyl Monomer Network With Polyurethane Matrix Therein 有权包含渗透液化乙烯基单体网络的抛光垫与其中的聚氨酯基体公开(公告)号：US20090077899A1
公开(公告)日：2009-03-26
申请号：US11989372
申请日：2006-07-19
申请人： In-Ha Park , Ju-Yeol Lee , Sung-Min Jun
发明人： In-Ha Park , Ju-Yeol Lee , Sung-Min Jun
CPC分类号： B24B37/24 , B24D3/34 , C08F283/006 , C08F290/067 , C08G18/10 , C08G18/3814 , C08G18/4825 , C08G2270/00 , C08J7/123 , C08J2375/04 , C08G18/6685
摘要： Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.
摘要翻译： 提供了聚氨酯抛光垫。 更具体地说，本发明提供一种聚氨酯抛光垫，其通过自由基聚合具有乙烯基聚合物与聚氨酯基质的互穿网络结构，并且不具有孔和气泡。 具有乙烯基聚合物的互穿网络结构的聚氨酯抛光垫由于热和浆料而显示均匀的分散性和降低的聚氨酯垫的硬度变化，从而不会由于研磨时的磨损热和在浆料中的溶解度而导致的抛光效率的劣化 ，并且还能够进行高温抛光操作。 此外，根据本发明，互穿网络结构导致改善的抛光速率和磨损性能，从而显着增加了抛光垫的使用寿命。
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2.发明申请Chemical Mechanical Polishing Pads Comprising Liquid Organic Material Encapsulated in Polymer Shell and Methods For Producing The Same 审中-公开化学机械抛光垫包含聚合物壳中的液体有机材料及其制造方法公开(公告)号：US20090320379A1
公开(公告)日：2009-12-31
申请号：US12309624
申请日：2007-07-20
申请人： Sung-Min Jun , Jong-Soo Lim , Seung-Hun Bae , Ju-Yeol Lee , In-Ha Park
发明人： Sung-Min Jun , Jong-Soo Lim , Seung-Hun Bae , Ju-Yeol Lee , In-Ha Park
IPC分类号： B24D3/00
摘要： There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130° C. or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.
摘要翻译： 提供了一种化学机械抛光（CMP）垫，其包括在聚合物基质中封装有沸点和分解点之一的液体有机材料的聚合物壳的芯，所述CMP垫具有开口 在其研磨表面上由芯形成的孔以及制造CMP垫的方法。 具有高硬度和高密度的CMP垫提高了晶片的抛光效率和平坦度，并且保持芯的均匀尺寸，从而制造具有高抛光效率和稳定的抛光性能的焊盘。
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3.发明授权Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein 有权含有聚氨酯基质的互穿液化乙烯基单体网络的抛光垫公开(公告)号：US07833297B2
公开(公告)日：2010-11-16
申请号：US11989372
申请日：2006-07-19
申请人： In-Ha Park , Ju-Yeol Lee , Sung-Min Jun
发明人： In-Ha Park , Ju-Yeol Lee , Sung-Min Jun
CPC分类号： B24B37/24 , B24D3/34 , C08F283/006 , C08F290/067 , C08G18/10 , C08G18/3814 , C08G18/4825 , C08G2270/00 , C08J7/123 , C08J2375/04 , C08G18/6685
摘要： Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.
摘要翻译： 提供了聚氨酯抛光垫。 更具体地，本发明提供一种聚氨酯抛光垫，其通过自由基聚合具有乙烯基聚合物与聚氨酯基质的互穿网络结构，并且不具有孔和气泡。 具有乙烯基聚合物的互穿网络结构的聚氨酯抛光垫由于热和浆料而显示均匀的分散性和降低的聚氨酯垫的硬度变化，从而不会由于研磨时的磨损热和在浆料中的溶解度而导致的抛光效率的劣化 ，并且还能够进行高温抛光操作。 此外，根据本发明，互穿网络结构导致改善的抛光速率和磨损性能，从而显着增加了抛光垫的使用寿命。
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