公开(公告)号：US20150004345A1

公开(公告)日：2015-01-01

申请号：US13928268

申请日：2013-06-26

Applicant: Industrial Technology Research Institute

Inventor： Meng-Ying Chaung ,  Kuo-Feng Chen ,  Chih-Chia Chang ,  Chen-Pang Kung

IPC: B32B7/14 ,  B32B7/02

CPC classification number: B32B7/14 ,  B32B7/02 ,  B32B2307/20 ,  B32B2307/40 ,  B32B2307/412 ,  B32B2405/00 ,  C09J5/06 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/24752

Abstract: An adhesive structure is disclosed. The adhesive structure includes a first layer, a second layer, and a hybrid adhesive layer for adhering the first layer to the second layer. The hybrid adhesive layer includes two or more adhesive units made of different adhesive materials, and the two or more adhesive units are arranged in a planar pattern.

Abstract translation: 公开了粘合剂结构。 粘合剂结构包括第一层，第二层和用于将第一层粘合到第二层的混合粘合剂层。 混合粘合剂层包括由不同粘合剂材料制成的两个或更多个粘合单元，并且两个或更多个粘合单元布置成平面图案。

公开(公告)号：US09333725B2

公开(公告)日：2016-05-10

申请号：US13928268

申请日：2013-06-26

Applicant: Industrial Technology Research Institute

Inventor： Meng-Ying Chuang ,  Kuo-Feng Chen ,  Chih-Chia Chang ,  Chen-Pang Kung

IPC: B32B7/14 ,  B32B7/02 ,  C09J5/06

CPC classification number: B32B7/14 ,  B32B7/02 ,  B32B2307/20 ,  B32B2307/40 ,  B32B2307/412 ,  B32B2405/00 ,  C09J5/06 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/24752

Abstract: An adhesive structure is disclosed. The adhesive structure includes a first layer, a second layer, and a hybrid adhesive layer for adhering the first layer to the second layer. The hybrid adhesive layer includes two or more adhesive units made of different adhesive materials, and the two or more adhesive units are arranged in a planar pattern.

Abstract translation: 公开了粘合剂结构。 粘合剂结构包括第一层，第二层和用于将第一层粘合到第二层的混合粘合剂层。 混合粘合剂层包括由不同粘合剂材料制成的两个或更多个粘合单元，并且两个或更多个粘合单元布置成平面图案。

公开(公告)号：US20150309628A1

公开(公告)日：2015-10-29

申请号：US14519149

申请日：2014-10-21

Applicant: Industrial Technology Research Institute

Inventor： Kuo-Feng Chen ,  Shu-Hsing Lee ,  Meng-Ying Chuang ,  Chih-Chia Chang

IPC: G06F3/047

CPC classification number: G06F3/041 ,  G02F1/133305 ,  G02F1/13338 ,  G02F2001/13332 ,  G06F1/1626 ,  G06F1/1652 ,  G06F2203/04102 ,  G06F2203/04103

Abstract: A package structure includes a first panel having a first surface and a second surface opposite to the first surface, a second panel having a third surface and a fourth surface opposite to the third surface, a first adhesive layer disposed between the first surface of the first panel and the third surface of the second panel, and a frame disposed on the side of the first panel and the first adhesive layer and disposed on the second surface of the first panel and the third surface of the second panel. The difference of the adhesive strength between the frame and the first adhesive layer is equal to or larger than 0.5N/25 mm. The width of the first panel is larger than the width of the frame, and the ratio of the width of the first panel to the width of the frame is between 15 and 83.

Abstract translation: 封装结构包括具有第一表面和与第一表面相对的第二表面的第一面板，具有与第三表面相对的第三表面和第四表面的第二面板，设置在第一表面的第一表面之间的第一粘合剂层 面板和第二面板的第三表面，以及设置在第一面板和第一粘合剂侧的框架，并且设置在第一面板的第二表面和第二面板的第三表面上。 框架和第一粘合剂层之间的粘合强度的差异等于或大于0.5N / 25mm。 第一面板的宽度大于框架的宽度，并且第一面板的宽度与框架的宽度之比在15和83之间。