公开(公告)号：US20240352281A1

公开(公告)日：2024-10-24

申请号：US18292056

申请日：2022-07-14

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Yuki USUI ,  Tetsuya SHINJO

IPC: C09J5/06 ,  C09J5/04 ,  C09J7/10 ,  C09J183/06 ,  H01L21/683

CPC classification number: C09J5/06 ,  C09J5/04 ,  C09J7/10 ,  C09J183/06 ,  H01L21/6835 ,  C09J2203/326 ,  C09J2301/208 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2301/502 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A method of manufacturing a laminate includes forming a first adhesive coating layer on a surface of a support substrate; forming a second adhesive coating layer on a surface of a semiconductor substrate; and bonding the first and second adhesive coating layer, followed by heating, to form an adhesive layer from the first adhesive coating layer and the second adhesive coating layer, wherein the first adhesive coating layer is formed from a first adhesive composition, the second adhesive coating layer is formed from a second adhesive composition, and one of the first adhesive composition and the second adhesive composition contains a first thermosetting component and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the other contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component.

公开(公告)号：US12122945B2

公开(公告)日：2024-10-22

申请号：US17691734

申请日：2022-03-10

Applicant: EQUISTAR CHEMICALS, LP

Inventor： Mick C. Hundley ,  Gang Zhang ,  William R. Podborny

IPC: C09J5/08 ,  B29C44/20 ,  B29C48/00 ,  B29C48/21 ,  B29C48/22 ,  B29C48/88 ,  B32B7/12 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  C08J9/06 ,  C09J5/06 ,  C09J7/22 ,  C09J123/02 ,  B29K23/00 ,  B29K105/00 ,  B29K105/04

CPC classification number: C09J5/08 ,  B29C44/20 ,  B29C48/022 ,  B29C48/21 ,  B29C48/22 ,  B29C48/9135 ,  B32B7/12 ,  B32B27/08 ,  B32B27/306 ,  B32B27/32 ,  B32B27/34 ,  C08J9/06 ,  C09J5/06 ,  C09J7/22 ,  C09J123/025 ,  B29K2023/06 ,  B29K2023/12 ,  B29K2105/0097 ,  B29K2105/04 ,  B32B2307/732 ,  C08J2323/02 ,  Y10T428/249984 ,  Y10T428/249985 ,  Y10T428/249991 ,  Y10T428/2843

Abstract: A multilayer film having enhanced toughness and optical properties is provided. The multilayer film includes a base layer, an outer layer, and a tie layer between the base layer and the outer layer. The multilayer film can also include additional layers. Methods for making such multilayer films are also provided. Multilayer films according to the present invention are particularly useful packaging applications where rupture resistance and high clarity are desirable.

公开(公告)号：US12122944B2

公开(公告)日：2024-10-22

申请号：US17616084

申请日：2019-12-19

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Yuzuru Takahashi

IPC: C09J5/06 ,  C09J123/08 ,  C09J191/06

CPC classification number: C09J5/06 ,  C09J123/0815 ,  C09J123/0853 ,  C09J191/06

Abstract: A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

公开(公告)号：US20240343955A1

公开(公告)日：2024-10-17

申请号：US18756620

申请日：2024-06-27

Applicant: PPG Industries Ohio, Inc.

Inventor： Umesh C. Desai ,  Tien-Chieh Chao ,  Masayuki Nakajima ,  Kaliappa G. Ragunathan

IPC: C09J163/00 ,  B82Y30/00 ,  C08G59/06 ,  C08G59/18 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  C09J5/00 ,  C09J5/06 ,  C08K3/04

CPC classification number: C09J163/00 ,  B82Y30/00 ,  C08G59/066 ,  C08G59/182 ,  C08G59/184 ,  C08G59/4276 ,  C08G59/5006 ,  C08L63/00 ,  C09J5/00 ,  C09J5/06 ,  C08K3/04 ,  C08L2205/02 ,  C09J2463/00

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

公开(公告)号：US20240343945A1

公开(公告)日：2024-10-17

申请号：US18294235

申请日：2022-07-29

Applicant: DOW TORAY CO., LTD.

Inventor： Yuki YOKOUCHI ,  Tomohiro IIMURA ,  Haruhiko FURUKAWA

IPC: C09J7/35 ,  C09J5/06 ,  C09J7/10

CPC classification number: C09J7/35 ,  C09J5/06 ,  C09J7/10 ,  C09J2203/326 ,  C09J2301/304 ,  C09J2301/416 ,  C09J2483/00

Abstract: Provided is a hot-melt type silicone composition that can be cured at a wide range of temperatures from low to high depending on the sealing process and the heat resistance of the resin members, in particular, that can realize good curability even at low temperatures such as room temperature, that imparts excellent transparency and resistance to yellowing to the resulting cured product, and that has excellent workability and handling in, e.g., overmolding. The curable hot-melt silicone composition comprises: (A) a resin-linear structure-containing organopolysiloxane block copolymer having a resinous organosiloxane block X containing a triorganosiloxane unit (MRA unit) having silicon atom-bound functional group (RA) containing an acrylic group or a methacrylic group, and a Q unit, and a chain organosiloxane block Y, and having at least two of the RA groups in the molecule; and (B) a radical polymerization initiator. Also provided are uses of the hot-melt type silicone composition.

公开(公告)号：US20240327681A1

公开(公告)日：2024-10-03

申请号：US18742857

申请日：2024-06-13

Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC

Inventor： Stefan Dehnicke ,  Gerd Becker ,  Anna Osichow ,  Philipp Zutavern ,  David Kistner

IPC: C09J11/06 ,  C08K5/32 ,  C09J5/02 ,  C09J5/06 ,  C09J11/08 ,  C09J111/00 ,  C09J115/02 ,  C09J123/28 ,  C09J123/34

CPC classification number: C09J11/06 ,  C09J5/02 ,  C09J5/06 ,  C09J11/08 ,  C09J111/00 ,  C09J115/02 ,  C09J123/28 ,  C09J123/34 ,  C08K5/32 ,  C09J2301/504 ,  C09J2400/163 ,  C09J2400/166 ,  C09J2411/00 ,  C09J2415/00 ,  C09J2421/006 ,  C09J2421/008 ,  C09J2423/00

Abstract: A water-based adhesive film-forming cover composition including: (i) at least one film forming polymer; (ii) at least one lower crystallinity first polynitroso compound; (iii) at least one higher crystallinity second polynitroso compound; (iv) at least one crosslinking agent; and (v) water as a carrier liquid; a bonding system including a combination of: (a) a water-based primer component; and (b) the above water-based cover component; a process for manufacturing the above bonding system; and a process of manufacturing a bonded article with the above bonding system. A bonded article, having a bonding line made from the above bonding system disposed between metal and rubber substrates, exhibits excellent stability against an aqueous urea-solution at temperatures of up to about 95° C.

公开(公告)号：US12104099B2

公开(公告)日：2024-10-01

申请号：US17369743

申请日：2021-07-07

Applicant: DENSO CORPORATION

Inventor： Masami Saito ,  Koji Kondo ,  Hirotaka Miyano

IPC: C09J5/02 ,  C09J5/06 ,  C09J163/00 ,  F16B11/00

CPC classification number: C09J5/02 ,  C09J5/06 ,  C09J163/00 ,  C09J2400/146 ,  C09J2400/163 ,  F16B11/006

Abstract: A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.

公开(公告)号：US20240318043A1

公开(公告)日：2024-09-26

申请号：US18259431

申请日：2021-12-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Elisabeth CURA ,  Nurettin YAVUZ ,  Jacek R. SAWICKI ,  Oliver LINGK ,  Michal NIEMIEC ,  Christian BEUER ,  Boris O.A. TASCH ,  Sandara BRZEZINSKI ,  Adrian JUNG ,  Eike KÜNKER

IPC: C09J7/21 ,  C09J5/06 ,  C09J163/00 ,  H02K15/03 ,  H02K15/12

CPC classification number: C09J7/21 ,  C09J5/06 ,  C09J163/00 ,  H02K15/03 ,  H02K15/12 ,  C09J2301/304 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/50 ,  H02K2213/03

Abstract: The present disclosure provides a structural adhesive film having a first major surface and a second major surface opposite the first major surface, wherein the structural adhesive film exhibits on the second major surface a lower coefficient of friction according to DIN EN ISO 8295 than on the first major surface, wherein the coefficient of friction according to DIN EN ISO 8295 of the second major surface is at least 15% lower than the coefficient of friction according to DIN EN ISO 8295 of the first major surface of the structural adhesive film.

公开(公告)号：US20240301248A1

公开(公告)日：2024-09-12

申请号：US18572022

申请日：2022-06-02

Applicant: Dow Global Technologies LLC

Inventor： Gang Lu ,  Nolan T. McDougal ,  Thomas R. Fielitz

IPC: C09J7/35 ,  C09J5/06 ,  C09J175/04

CPC classification number: C09J7/35 ,  C09J5/06 ,  C09J175/04 ,  C09J2301/312 ,  C09J2301/50 ,  C09J2475/00

Abstract: A fire-retardant polyurethane-based laminating adhesive composition including: (a) at least one polyol component; (b) at least one polyisocyanate component; and (c) at least one alkoxysilane hydrolysate or at least one aryloxysilane hydrolysate; wherein the fire-retardant polyurethane-based laminating adhesive composition has a fire retardancy rating of HB in UL94HB testing; a process for making the above fire-retardant adhesive composition; and a process for adhering two substrates together with the above fire-retardant adhesive composition.

公开(公告)号：US20240247173A1

公开(公告)日：2024-07-25

申请号：US18289814

申请日：2021-05-26

Applicant: Lignum Technologies AG

Inventor： Manfred Dunky ,  Luis Miguel Olaechea ,  Ingo Mayer ,  Reto Frei

IPC: C09J161/24 ,  B29C35/02 ,  B29C65/48 ,  B29K61/00 ,  C08G12/12 ,  C08G12/42 ,  C09J5/06 ,  C09J161/30

CPC classification number: C09J161/24 ,  B29C35/02 ,  B29C65/4835 ,  C08G12/12 ,  C08G12/422 ,  C09J5/06 ,  C09J161/30 ,  B29K2061/00 ,  C08G2170/20

Abstract: A temperature-curable aminoplastic adhesive resin that is a (poly)-condensate of: (i) at least one aminoplast-forming chemical; (ii) 5-hydroxymethylfurfural (5-HMF), its oligomers and/or its isomers; and, (iii) at the least one second (poly-)condensable chemical. Composite boards, such as wood-based panels, can be produced using this adhesive resin. The production of the aminoplastic adhesive resin includes the reaction of urea with 5-hydroxymethylfurfural (5-HMF) and glyoxal. The adhesive resin can be used in the production of wood-based panels such as particleboards, fiberboards and products usually called, among others, plywood and/or blockboards.