公开(公告)号：US20230201960A1

公开(公告)日：2023-06-29

申请号：US17672967

申请日：2022-02-16

Applicant: Industrial Technology Research Institute

Inventor： PIN-HAO HU ,  FU-LUNG CHOU ,  YU-CHUNG LIN ,  MIN-KAI LEE

IPC: B23K26/06 ,  B23K26/082 ,  B23K26/073 ,  B23K26/382

CPC classification number: B23K26/0648 ,  B23K26/082 ,  B23K26/073 ,  B23K26/382

Abstract: A method for generating Bessel beams includes the steps of: utilizing a light source to generate an incident beam to a phase modulation module; utilizing the phase modulation module to rectify the incident beam into a circular beam, and to modulate a phase of the circular beam into an asymmetric phase so as to form an asymmetric collimated circular beam provided to a scanning module; utilizing the scanning module to compensate the asymmetric collimated circular beam, and utilizing the asymmetric collimated circular beam to scan at different angles and then enter a focusing element; and, utilizing the focusing element to focus and interfere the asymmetric collimated circular beam into form a Bessel beam for machining.

公开(公告)号：US20200147729A1

公开(公告)日：2020-05-14

申请号：US16279186

申请日：2019-02-19

Applicant: Industrial Technology Research Institute

Inventor： HSIN-YU CHANG ,  FU-LUNG CHOU ,  CHIEN-JUNG HUANG ,  YU-CHUNG LIN ,  MIN-KAI LEE

IPC: B23K26/362

Abstract: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.