公开(公告)号：US20250079330A1

公开(公告)日：2025-03-06

申请号：US18806062

申请日：2024-08-15

Applicant: Infineon Technologies AG

Inventor： Mahadi-Ul HASSAN ,  Mark PAVIER

IPC: H01L23/544 ,  H01L23/31 ,  H01L23/498

Abstract: An embedded chip-package is provided. In one example, the embedded chip-package includes a chip, an electrically insulating material at least partially encapsulating the chip, at least one metal layer configured to provide at least one electrically conductive connection to the chip, and an information section. The information section includes coded information about the embedded chip-package, wherein, in the information section, the information is coded as a pattern of electrically conductive portions and electrically insulating portions.

公开(公告)号：US20190006260A1

公开(公告)日：2019-01-03

申请号：US16111606

申请日：2018-08-24

Applicant: Infineon Technologies AG

Inventor： Mark PAVIER ,  Wolfram HABLE ,  Angela KESSLER ,  Michael SIELAFF ,  Anton PUGATSCHOW ,  Charles RIMBERT-RIVIERE ,  Marco SOBKOWIAK

IPC: H01L23/373 ,  B60R16/02 ,  H01L21/56 ,  H01L21/48 ,  H01L25/18 ,  H01L23/29 ,  H01L23/00 ,  H01L23/498 ,  H01L23/50 ,  H01L23/31

Abstract: A method of manufacturing a package, wherein the method comprises a forming a chip carrier by covering a thermally conductive and electrically insulating core on both opposing main surfaces thereof at least partially by a respective electrically conductive layer by brazing the respective electrically conductive layer on a respective one of the main surfaces; a mounting at least one electronic chip on the chip carrier; an electrically coupling an electrically conductive contact structure with the at least one electronic chip; and an encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip by a mold-type encapsulant.