公开(公告)号：US20190006260A1

公开(公告)日：2019-01-03

申请号：US16111606

申请日：2018-08-24

Applicant: Infineon Technologies AG

Inventor： Mark PAVIER ,  Wolfram HABLE ,  Angela KESSLER ,  Michael SIELAFF ,  Anton PUGATSCHOW ,  Charles RIMBERT-RIVIERE ,  Marco SOBKOWIAK

IPC: H01L23/373 ,  B60R16/02 ,  H01L21/56 ,  H01L21/48 ,  H01L25/18 ,  H01L23/29 ,  H01L23/00 ,  H01L23/498 ,  H01L23/50 ,  H01L23/31

Abstract: A method of manufacturing a package, wherein the method comprises a forming a chip carrier by covering a thermally conductive and electrically insulating core on both opposing main surfaces thereof at least partially by a respective electrically conductive layer by brazing the respective electrically conductive layer on a respective one of the main surfaces; a mounting at least one electronic chip on the chip carrier; an electrically coupling an electrically conductive contact structure with the at least one electronic chip; and an encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip by a mold-type encapsulant.