公开(公告)号：US20140347818A1

公开(公告)日：2014-11-27

申请号：US14282556

申请日：2014-05-20

Applicant: Infineon Technologies AG

Inventor： Andre Uhlemann ,  Thorsten Fath

IPC: H05K7/20 ,  H02M7/00

CPC classification number: H05K7/20927 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002 ,  H02M7/003 ,  Y10T29/41 ,  H01L2924/00

Abstract: A power semiconductor module includes a substrate and a two-part cooling system arranged under the substrate. The cooling system has upper and lower pieces. The upper piece forms a flow channel with the substrate for a cooling liquid. The upper piece has a first inflow and an outflow, through which the cooling liquid can be introduced into the flow channel and removed. The upper piece also has at least one second inflow, which is spaced apart from the first inflow in a longitudinal direction. The lower piece has an inlet and an outlet, the outlet being connected to the outflow and the inlet being connected to the first inflow. The lower piece also has a channel branching off from the inlet, which includes at least one bypass channel, which is connected to the second inflow, so part of the cooling liquid passes through the bypass channel into the flow channel.

Abstract translation: 功率半导体模块包括基板和布置在基板下方的两部分冷却系统。 冷却系统具有上下部件。 上部件与用于冷却液体的基板形成流动通道。 上部件具有第一流入和流出，冷却液可通过该第一流入和流出流入流动通道并被移除。 上部件还具有至少一个第二流入件，其沿着纵向方向与第一流入物间隔开。 下部件具有入口和出口，出口连接到流出口，入口连接到第一流入口。 下部件还具有从入口分支的通道，该通道包括至少一个旁通通道，其连接到第二流入口，因此部分冷却液体通过旁路通道进入流动通道。

公开(公告)号：US09578789B2

公开(公告)日：2017-02-21

申请号：US14282556

申请日：2014-05-20

Applicant: Infineon Technologies AG

Inventor： Andre Uhlemann ,  Thorsten Fath

IPC: H05K7/20 ,  H01L23/367 ,  H02M7/00 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002 ,  H02M7/003 ,  Y10T29/41 ,  H01L2924/00

Abstract: A power semiconductor module includes a substrate and a two-part cooling system arranged under the substrate. The cooling system has upper and lower pieces. The upper piece forms a flow channel with the substrate for a cooling liquid. The upper piece has a first inflow and an outflow, through which the cooling liquid can be introduced into the flow channel and removed. The upper piece also has at least one second inflow, which is spaced apart from the first inflow in a longitudinal direction. The lower piece has an inlet and an outlet, the outlet being connected to the outflow and the inlet being connected to the first inflow. The lower piece also has a channel branching off from the inlet, which includes at least one bypass channel, which is connected to the second inflow, so part of the cooling liquid passes through the bypass channel into the flow channel.

Abstract translation: 功率半导体模块包括基板和布置在基板下方的两部分冷却系统。 冷却系统具有上下部件。 上部件与用于冷却液体的基板形成流动通道。 上部件具有第一流入和流出，冷却液可通过该第一流入和流出流入流动通道并被移除。 上部件还具有至少一个第二流入件，其沿着纵向方向与第一流入物间隔开。 下部件具有入口和出口，出口连接到流出口，入口连接到第一流入口。 下部件还具有从入口分支的通道，该通道包括至少一个旁通通道，其连接到第二流入口，因此部分冷却液体通过旁路通道进入流动通道。