公开(公告)号：US20230402292A1

公开(公告)日：2023-12-14

申请号：US17850999

申请日：2022-06-27

Applicant: InnoLux Corporation

Inventor： Chuan-Ming YEH ,  Heng-Shen YEH ,  Sheng-Hui CHIU ,  Kuo-Jung FAN

IPC: H01L21/48 ,  H01L23/00

CPC classification number: H01L21/4857 ,  H01L24/81 ,  H01L24/13 ,  H01L2224/81815 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/13147 ,  H01L2224/81447 ,  H01L2224/81466

Abstract: A method of manufacturing an electronic device includes providing a substrate, providing an intermediate layer on the substrate, and providing an isolation layer on the intermediate layer. The substrate includes an active region and a peripheral region. The peripheral region is adjacent to the active region, and the ratio of the area of the active region to the area of the substrate surface is between 75% and 92%. The isolation layer includes a first surface and at least one slope. The first surface of the isolation layer is correspondingly disposed in the active region. The at least one slope of the isolation layer is correspondingly disposed in the peripheral region and at a first angle with respect to the substrate surface.

公开(公告)号：US20230038309A1

公开(公告)日：2023-02-09

申请号：US17736112

申请日：2022-05-04

Applicant: InnoLux Corporation

Inventor： Yi-Hung LIN ,  Chun-Hung LAI ,  Yeong-E CHEN ,  Chuan-Ming YEH ,  Ching-Wei CHEN

IPC: H05K1/02

Abstract: A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.