公开(公告)号：US20220216351A1

公开(公告)日：2022-07-07

申请号：US17545184

申请日：2021-12-08

Applicant: InnoLux Corporation

Inventor： Wei-Lin WAN ,  Yu-Tsung LIU ,  Ming-Chih CHEN ,  Te-Yu LEE

IPC: H01L31/0216 ,  H01L31/18

Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.