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公开(公告)号:US20220216351A1
公开(公告)日:2022-07-07
申请号:US17545184
申请日:2021-12-08
Applicant: InnoLux Corporation
Inventor: Wei-Lin WAN , Yu-Tsung LIU , Ming-Chih CHEN , Te-Yu LEE
IPC: H01L31/0216 , H01L31/18
Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.