公开(公告)号：US20210151083A1

公开(公告)日：2021-05-20

申请号：US17133484

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Aiswarya M. PIOUS ,  Raji JAMES ,  Phani K. ALAPARTHI ,  George VERGIS ,  Bill NALE ,  Konika GANGULY

IPC: G11C5/14

Abstract: Examples described herein relate to a device that includes: a first power rail to provide a signal from a power source to a reference supply voltage pin of a memory controller; a second power rail to provide a signal from the power source to an output buffer pin of the memory controller and to an output buffer pin of a central processing unit (CPU). In some examples, the second power rail is separate from the first power rail, during a high power state, the power source is to supply a same voltage to each of the reference supply voltage pin, the output buffer pin of the memory controller, and the output buffer pin of the CPU, and during a connected standby state, the power source is to reduce voltage provided to the output buffer pin of the memory controller and the output buffer pin of the CPU using the second power rail and maintain a voltage provided to the reference supply voltage pin.

公开(公告)号：US20220077609A1

公开(公告)日：2022-03-10

申请号：US17479596

申请日：2021-09-20

Applicant: Intel Corporation

Inventor： Navneet Kumar SINGH ,  Aiswarya M. PIOUS ,  Richard S. PERRY ,  Amarjeet KUMAR ,  Siva Prasad JANGILI GANGA ,  Gaurav HADA ,  Sushil PADMANABHAN ,  Konika GANGULY

IPC: H01R12/70 ,  H01R12/73 ,  H01R43/26

Abstract: A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.