公开(公告)号：US20240063203A1

公开(公告)日：2024-02-22

申请号：US17889962

申请日：2022-08-17

Applicant: Intel Corporation

Inventor： Brandon C. MARIN ,  Ravindranath V. MAHAJAN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Suddhasattwa NAD ,  Jeremy D. ECTON ,  Navneet SINGH ,  Sushil PADMANABHAN ,  Samarth ALVA

IPC: H01L25/18 ,  H01L23/15 ,  H01L23/538 ,  H01L23/48 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/18 ,  H01L23/15 ,  H01L23/5383 ,  H01L23/481 ,  H01L23/5384 ,  H01L21/486 ,  H01L21/4857 ,  H01L25/50 ,  H01L21/56

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass, and buildup layers over the first substrate. In an embodiment, a first die is over the buildup layers, a second die is over the buildup layers and adjacent to the first die, and where conductive routing in the buildup layers electrically couples the first die to the second die.

公开(公告)号：US20220077609A1

公开(公告)日：2022-03-10

申请号：US17479596

申请日：2021-09-20

Applicant: Intel Corporation

Inventor： Navneet Kumar SINGH ,  Aiswarya M. PIOUS ,  Richard S. PERRY ,  Amarjeet KUMAR ,  Siva Prasad JANGILI GANGA ,  Gaurav HADA ,  Sushil PADMANABHAN ,  Konika GANGULY

IPC: H01R12/70 ,  H01R12/73 ,  H01R43/26

Abstract: A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.