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公开(公告)号：US20210225374A1
公开(公告)日：2021-07-22
申请号：US17133323
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Sumod Cherukkate , Srikanth Potluri , Ajesh K K , Xintian Lin
Abstract: A system, article, and method of environment-sensitive wake-on-voice initiation uses ultrasound signals.
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公开(公告)号：US20190324496A1
公开(公告)日：2019-10-24
申请号：US16457046
申请日：2019-06-28
Applicant: Intel Corporation
Inventor： Sumod Cherukkate , Gopinath K , Prakash Kurma Raju , Ajesh K K
Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.
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公开(公告)号：US11119532B2
公开(公告)日：2021-09-14
申请号：US16457046
申请日：2019-06-28
Applicant: Intel Corporation
Inventor： Sumod Cherukkate , Gopinath K , Prakash Kurma Raju , Ajesh K K
IPC: H05K1/16 , H05K5/00 , H05K7/00 , H05K7/04 , H04R1/00 , H04R1/02 , H04R1/08 , H04R1/10 , H04R1/20 , H04R1/32 , H04R3/00 , H04R11/04 , H04R19/00 , H04M1/00 , H04M1/03 , G06F1/18 , B81B3/00 , B81C1/00 , G06F1/16 , H05K1/11 , H05K1/18
Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.
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