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公开(公告)号：US20240431061A1
公开(公告)日：2024-12-26
申请号：US18824590
申请日：2024-09-04
Applicant: Intel Corporation
Inventor： Alonso Rodriguez Chacon , Arturo Navarro Alvarez , Jeff Ku
Abstract: Example fittings that combine standoffs and springs for supporting thermal solutions are disclosed herein. An example electronic device includes a chassis; a substrate; a thermal solution; and a fitting to separate the substrate from the chassis and to separate the thermal solution from the substrate, the fitting including a standoff end and a spring end.
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