公开(公告)号：US20220117114A1

公开(公告)日：2022-04-14

申请号：US17556620

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Oscar FARIAS MOGUEL ,  Javier AVALOS GARCIA ,  Oscar A. DEL RIO GONZALEZ ,  Andres RAMIREZ MACIAS ,  Maria de la Luz BELMONT ,  Jessica GULLBRAND ,  Aravind MUNUKUTLA ,  Anil Kumar KURELLA ,  Samantha YATES

IPC: H05K7/20 ,  B01D57/02

Abstract: An apparatus is described. The apparatus includes a particle collector to collect particles from an electrically insulating liquid that one or more electronic devices are to be immersed within. The particle collector having an input port to receive the electrically insulating liquid. The particle collector having an output port to emit the electrically insulating liquid. The particle collector having one or more phoretic force devices. The phoretic force devices to induce phoretic forces within the particle collector that cause the particles to collect within the particle collector. A structure is also described. The structure is to be immersed in electrically insulating liquid and mimic a boiling enhancement layer of a cooling assembly of a chip package disposed on an electronic circuit board that is also immersed in the electrically insulating liquid.

公开(公告)号：US20210327787A1

公开(公告)日：2021-10-21

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Xicai JING ,  Yuan-Liang LI ,  Yuyang XIA ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Maria de la Luz BELMONT ,  Oscar FARIAS MOGUEL ,  Andres RAMIREZ MACIAS ,  Javier AVALOS GARCIA ,  Jessica GULLBRAND ,  Shaorong ZHOU ,  Chia-Pin CHIU ,  Xiaojin GU

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.