公开(公告)号：US20210410329A1

公开(公告)日：2021-12-30

申请号：US17475026

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Mengqi LIU ,  Phil GENG ,  Ralph V. MIELE ,  Sandeep AHUJA ,  David SHIA

IPC: H05K7/20 ,  H01L23/367

Abstract: An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

公开(公告)号：US20210327787A1

公开(公告)日：2021-10-21

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Xicai JING ,  Yuan-Liang LI ,  Yuyang XIA ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Maria de la Luz BELMONT ,  Oscar FARIAS MOGUEL ,  Andres RAMIREZ MACIAS ,  Javier AVALOS GARCIA ,  Jessica GULLBRAND ,  Shaorong ZHOU ,  Chia-Pin CHIU ,  Xiaojin GU

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20210321543A1

公开(公告)日：2021-10-14

申请号：US17357776

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Guixiang TAN ,  Xiang LI ,  Jimmy CHUANG ,  Devdatta P. KULKARNI ,  Casey WINKEL ,  Evan A. CHENELLY

IPC: H05K7/20 ,  G06F1/20 ,  G11C5/04

Abstract: An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.

公开(公告)号：US20240064931A1

公开(公告)日：2024-02-22

申请号：US18499112

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Jimmy CHUANG ,  Yuehong FAN ,  Jing-Hua HE ,  Sandeep AHUJA ,  Jay WU ,  Dongrui XUE ,  Xiaowei LI

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/473

CPC classification number: H05K7/20263 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20236 ,  H05K7/20254 ,  H05K7/20763 ,  H05K7/20272

Abstract: An apparatus is described. The apparatus includes a coolant distribution unit having a first primary loop output to provide first cooled immersion liquid to an immersion chamber and a second primary loop output to provide second cooled immersion liquid to one or more cold plates within the immersion chamber.

公开(公告)号：US20240096741A1

公开(公告)日：2024-03-21

申请号：US18520425

申请日：2023-11-27

Applicant: Intel Corporation

Inventor： Phil GENG ,  David SHIA ,  Ralph V. MIELE ,  Guixiang TAN ,  Jimmy CHUANG ,  Sandeep AHUJA ,  Sanjoy K. SAHA ,  Jeffory L. SMALLEY ,  Mark E. SPRENGER

IPC: H01L23/427

CPC classification number: H01L23/427

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

公开(公告)号：US20220223495A1

公开(公告)日：2022-07-14

申请号：US17711354

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： David SHIA ,  Jimmy CHUANG ,  Jin YANG

IPC: H01L23/427 ,  H01L23/40

Abstract: A cooling assembly is described. The cooling assembly includes a semiconductor chip package having input/outputs (I/Os) on a first surface and a package lid that is opposite the first surface, the semiconductor chip package has sides between the first surface and the package lid. The cooling assembly includes a structured element. The structured element has a structured surface to nucleate bubbles in a bath of coolant. The structured element has fixturing elements to secure the structured element to at least first and second ones of the sides of the semiconductor chip package. The structured element has a first thermal resistance. The cooling assembly has a thermal interface material between the package lid and the structured element. The thermal interface material has a second thermal resistance that is greater than the first thermal resistance and within an order of magnitude of the first thermal resistance.