公开(公告)号：US11830863B2

公开(公告)日：2023-11-28

申请号：US17539088

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Suresh V. Pothukuchi ,  Andrew Alduino ,  Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Ling Liao ,  Harinadh Potluri ,  David M. Bond ,  Sushrutha Reddy Gujjula ,  Donald Tiendung Tran ,  David Hui ,  Vladimir Tamarkin

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

CPC classification number: H01L25/167 ,  H01L23/367 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/473 ,  H01L23/5385 ,  H01L23/5386 ,  H04Q11/0005 ,  H01L2023/4031 ,  H04Q2011/0039

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US11217573B2

公开(公告)日：2022-01-04

申请号：US16809515

申请日：2020-03-04

Applicant: Intel Corporation

Inventor： Suresh V. Pothukuchi ,  Andrew Alduino ,  Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Ling Liao ,  Harinadh Potluri ,  David M. Bond ,  Sushrutha Reddy Gujjula ,  Donald Tiendung Tran ,  David Hui ,  Vladimir Tamarkin

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.